2007 Proceedings 57th Electronic Components and Technology Conference 2007
DOI: 10.1109/ectc.2007.374080
|View full text |Cite
|
Sign up to set email alerts
|

Fully Embedded High Q Passives and Band Pass Filters for Low Cost Organic RF SOP (System on Package) Applications

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Year Published

2007
2007
2009
2009

Publication Types

Select...
4
1

Relationship

0
5

Authors

Journals

citations
Cited by 13 publications
(2 citation statements)
references
References 14 publications
0
2
0
Order By: Relevance
“…To overcome some drawbacks of LTCC packaging technology, the designed passive circuit was fully embedded into a multilayered organic packaging substrate. To improve their performance characteristics and reduce its size/volume, vertically stacked spiral high Q inductors and high dielectric BaTiO3 MIM composite capacitors were newly applied [7,8]. Finally, passive quintplexer module has been demonstrated by assembling fabricated passive triplexer with DCN and PCS duplexers onto PCB evaluation board.…”
Section: Acknowledgmentsmentioning
confidence: 99%
See 1 more Smart Citation
“…To overcome some drawbacks of LTCC packaging technology, the designed passive circuit was fully embedded into a multilayered organic packaging substrate. To improve their performance characteristics and reduce its size/volume, vertically stacked spiral high Q inductors and high dielectric BaTiO3 MIM composite capacitors were newly applied [7,8]. Finally, passive quintplexer module has been demonstrated by assembling fabricated passive triplexer with DCN and PCS duplexers onto PCB evaluation board.…”
Section: Acknowledgmentsmentioning
confidence: 99%
“…The 2nd and 3rd layers are utilized for making MIM capacitors with high capacitance density. Embedded circular inductors are formed onto the 1st and 3rd layer [7]. Figure 6 shows photomicrograph of fully embedded passive triplexer into eight-layered organic packaging substrate.…”
Section: Design and Fabricationmentioning
confidence: 99%