2007 Asia-Pacific Microwave Conference 2007
DOI: 10.1109/apmc.2007.4554838
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PCB Embedded 2.4GHz Compact Bandpass Filter with Two Finite Transmission Zeros

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Cited by 8 publications
(2 citation statements)
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“…To overcome some drawbacks of LTCC packaging technology, the designed passive circuit was fully embedded into a multilayered organic packaging substrate. To improve their performance characteristics and reduce its size/volume, vertically stacked spiral high Q inductors and high dielectric BaTiO3 MIM composite capacitors were newly applied [7,8]. Finally, passive quintplexer module has been demonstrated by assembling fabricated passive triplexer with DCN and PCS duplexers onto PCB evaluation board.…”
Section: Acknowledgmentsmentioning
confidence: 99%
“…To overcome some drawbacks of LTCC packaging technology, the designed passive circuit was fully embedded into a multilayered organic packaging substrate. To improve their performance characteristics and reduce its size/volume, vertically stacked spiral high Q inductors and high dielectric BaTiO3 MIM composite capacitors were newly applied [7,8]. Finally, passive quintplexer module has been demonstrated by assembling fabricated passive triplexer with DCN and PCS duplexers onto PCB evaluation board.…”
Section: Acknowledgmentsmentioning
confidence: 99%
“…Its restricted bandwidth and necessity of using additional external matching elements can be noticed as the main usual disadvantages of the SAW filters. The LTCC technology, in turn, allows to use its high integration possibilities and there are a plenty of bandpass filters, integrated in the LTCC substrate, have been already described [2][3][4][5][6]. But due to comparatively not a high Q factor of resonators, realized within LTCC substrate, the selectivity of such filters could be not enough.…”
Section: Introductionmentioning
confidence: 99%