Full-Wave Modeling of Stripline Structures in Multilayer Dielectrics

Nikellis, Konstantinos; Uzunoglu, N.K.; Koutsoyannopoulos, Y.; Bantas, Sotiris

doi:10.2528/pier05071302

Cited by 4 publications

(4 citation statements)

References 16 publications

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“…They possess very low conductivity, which is one of the considerations for microwave applications. The conductivity greatly influences the dielectric [3][4][5][6][7] and magnetic behavior of ferrites [8,9]. This created considerable interest in many research workers for the development and potential applications of ferrites in the electronic industry [10][11][12].…”

Section: Introductionmentioning

confidence: 99%

INFLUENCE OF TIME AND TEMPERATURE ON RESISTIVITY AND MICROSTRUCTURE OF Cux Co1-x Fe2 O4 MIXED FERRITES

Bammannavar¹,

Naik²,

Pujar³

et al. 2008

PIER Letters

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Abstract-Copper-cobalt ferrites with general chemical formula Cu x Co 1−x Fe 2 O 4 (with x = 0.0, 0.4, 0.6 & 1.0) were prepared by ceramic method. The solid state reaction was confirmed by XRD patterns. DC conductivity was measured by two probe method. Electrical resistivity is found to increase on lowering of sintering temperature and time. At x = 1.0, the conduction is mainly due to hopping of electrons leading to n-type conductivity while at x = 0.0, conduction is due to holes leading to P-type conductivity. The lowest conduction at x = 0.4 is attributed to the electron hole compensation. SEM micrographs were obtained from JEOL scanning electron microscope. The micrographs reveal that an average grain size increases with sintering temperature and time as a result of decrease in porosity. This leads to the decrease in resistivity with sintering temperature and time. One of the factors for higher conductivity in ferrites is an increase in average grain size and decrease in pore concentration during the heat treatment.

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Section: Introductionmentioning

confidence: 99%

INFLUENCE OF TIME AND TEMPERATURE ON RESISTIVITY AND MICROSTRUCTURE OF Cux Co1-x Fe2 O4 MIXED FERRITES

Bammannavar¹,

Naik²,

Pujar³

et al. 2008

PIER Letters

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“…In particular, characterization of dielectric substrates for printed circuit boards (PCBs) is vital to achieve the first-pass success in modern highspeed digital system designs. When the on-board data rate is in the Gbps (gigabits per second) range or higher, traces and discontinuities including vias, AC coupling pads, and trace bends on a signal path have to be modeled to catch the channel response accurately [1][2][3]. A static field solver is not sufficient to model these discontinuities and traces, and full-wave modeling tools have to be used.…”

Section: Introductionmentioning

confidence: 99%

Planar Transmission Line Method for Characterization of Printed Circuit Board Dielectrics

Zhang¹,

Koledintseva²,

Antonini³

et al. 2010

PIER

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Abstract-An effective approach to characterize frequency-dispersive sheet materials over a wide RF and microwave frequency range based on planar transmission line geometries and a genetic algorithm is proposed. S-parameters of a planar transmission line structure with a sheet material under test as a substrate of this line are measured using a vector network analyzer (VNA). The measured S-parameters are then converted to ABCD matrix parameters. With the assumption of TEM/quasi-TEM wave propagation on the measured line, as well as reciprocity and symmetry of the network, the complex propagation constant can be found, and the corresponding phase constant and attenuation constant can be retrieved. Attenuation constant includes both dielectric loss and conductor loss terms. At the same time, phase term, dielectric loss and conductor loss can be calculated for a known transmission line geometry using corresponding closedform analytical or empirical formulas. These formulas are used to construct the objective functions for approximating phase constants, conductor loss and dielectric loss in an optimization procedure based on a genetic algorithm (GA). The frequency-dependent dielectric properties of the substrate material under test are represented as one or a few terms following the Debye dispersion law.The parameters of the Debye dispersion law are extracted using the GA by minimizing the discrepancies between the measured and the corresponding approximated loss and phase terms. The extracted data is verified by substituting these data in full-wave numerical modeling of structures containing these materials and comparing the simulated results with experimental.

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“…The method of edge currents was applied and tested to estimating mutual inductance for symmetrical and asymmetrical microstrip lines [1]. Along with microstrip structures [9][10][11][12][13][14], there is an increasing interest to the analysis of stripline geometries, because of their applications for antenna and interconnect design [15][16][17][18][19][20]. In the present paper, the method of edge currents is extended for symmetrical and asymmetrical stripline structures.…”

Section: Introductionmentioning

confidence: 99%

“…This method employs a quasi-static (quasi-magnetostatic) approach, image theory, and direct magnetic field integration for calculating the mutual external inductance of a planar transmission line structure with ground planes of finite width. This inductance is of interest from electromagnetic immunity point of view, since it is a culprit of "ground plane noise", or a common-mode voltage, that appears on the reference plane due to fringing magnetic fields wrapping the plane, and drives unintentional "antennas" formed by parts of the electronic equipment [2][3][4][5][6][7][8]. This mutual external inductance associated with fringing magnetic fields wrapping the ground plane of a stripline structure is defined as the mutual inductance between the signal current loop and the common mode "antenna" current loop located either above the top ground plane, or beneath the bottom ground plane.…”

Section: Introductionmentioning

confidence: 99%

Mutual External Inductance in Stripline Structures

Koledintseva¹,

Drewniak²,

Doren³

et al. 2008

PIER

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Abstract-The Method of Edge Currents (MEC) proposed in our previous paper [1] is applied herein for calculating the mutual external inductance associated with fringing magnetic fields that wrap ground planes of a stripline structure. This method employs a quasi-static approach, image theory, and direct magnetic field integration. The resultant mutual external inductance is frequency-independent. The approach has been applied to estimating mutual inductance for both symmetrical and asymmetrical stripline structures. Offset of the signal trace from the centered position both in horizontal and vertical directions is taken into account in asymmetrical structures. The results are compared with numerical simulations using the CST Microwave Studio Software.

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Full-Wave Modeling of Stripline Structures in Multilayer Dielectrics

Cited by 4 publications

References 16 publications

INFLUENCE OF TIME AND TEMPERATURE ON RESISTIVITY AND MICROSTRUCTURE OF Cu<sub>x</sub> Co<sub>1-x</sub> Fe<sub>2</sub> O<sub>4</sub> MIXED FERRITES

INFLUENCE OF TIME AND TEMPERATURE ON RESISTIVITY AND MICROSTRUCTURE OF Cu<sub>x</sub> Co<sub>1-x</sub> Fe<sub>2</sub> O<sub>4</sub> MIXED FERRITES

Planar Transmission Line Method for Characterization of Printed Circuit Board Dielectrics

Mutual External Inductance in Stripline Structures

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