Full-wave modeling of inductive coupling links for low-power 3D system integration

Vali, Tommaso; Marotta, G.; Santis, Luca De; Antonini, Giulio; Romano, Daniele; Luca, Giovanni De

doi:10.1109/isemc.2013.6670374

Cited by 5 publications

(4 citation statements)

References 14 publications

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“…Inductive coupling links exploit the coupled magnetic field between transmit (Tx) receive (Rx) coils and hence facilitate communication of data without physical connection between dies, making them a promising choice for cost-effective (yet, high performance) 3D integration [6]. Whilst interest in the 3D-IC design space is fairly recent, inductive coupling is not a new technology with applications in many areas such as wireless charging, RFID and bio-implanted sensors.…”

Section: Background and Related Workmentioning

confidence: 99%

“…These solvers provide high accuracy, however often take hours to converge at a solution and require manual curve fitting to translate the results to a SPICE model. Alternative solvers include the partial element equivalent circuit (PEEC) method (used in [6] for analysing inductive coupling links in 3D-IC). PEEC solvers, however, still often take a long time to converge at a solution [5], making them too slow for use in optimisation.…”

Section: Background and Related Workmentioning

confidence: 99%

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A high-speed design methodology for inductive coupling links in 3D-ICs

Fletcher

Das

Mak

2018

2018 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE)

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Inductive coupling links (ICLs) are gaining traction as an alternative to through silicon vias (TSVs) for 3D integration, promising high-bandwidth connectivity without the inflated fabrication costs associated with TSV-enabled processes. For power-efficient ICL design, optimisation of the utilised physical inductor geometries is essential, however typically necessitates the use of finite element analysis (FEA) in addition to manual parameter fitting, a process that can take several hours even for a single geometry. As a result, the generation of optimised inductor designs poses a significant challenge. In this paper, we address this challenge, presenting a CAD-tool for Optimisation of Inductive coupling Links for 3D-ICs (COIL-3D 1). COIL-3D uses a rapid solver based upon semi-empirical expressions to quickly and accurately characterise a given link, in conjunction with a high-speed refined optimisation flow to find optimal inductor geometries for use in ICL-based 3D-ICs. The proposed solver achieves an average accuracy within 9.1% of commercial FEA software tools, and the proposed optimisation flow reduces the search time by 26 orders of magnitude. This work unlocks new potential for power-efficient 3D integration using inductive coupling links.

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Section: Background and Related Workmentioning

confidence: 99%

Section: Background and Related Workmentioning

confidence: 99%

A high-speed design methodology for inductive coupling links in 3D-ICs

Fletcher

Das

Mak

2018

2018 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE)

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“…Examples are the two-coil WPT devices used in the framework of wireless charging systems for battery electric vehicles (BEV). Here, electrical energy is transmitted from an emitter to a receiver via magnetic induction without resorting to wires and cables [15][16][17][18][19][20], and it is easily understood how the efficiency of the energy transfer is strictly related to the strength of the magnetic coupling.…”

Section: Introductionmentioning

confidence: 99%

A Rigorous Explicit Expression for the Mutual Inductance of Two Co-Axial Thin-Wire Coil Antennas Placed above a Layered Ground

Parise,

Antonini,

Di Paola

2023

Energies

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This paper presents a quasi-analytical method that allows the derivation of a rigorous series-form representation for the mutual inductance of two co-axial coil antennas located above an arbitrarily layered earth structure. Starting from Biot–Savart law, which gives the integral representation for the primary vector potential generated by the source coil, the potential reflected by the layered ground is derived, and the resulting total vector potential is then integrated along the external circumference of the receiving coil to give the mutual inductance of the two antennas. The obtained representation for the flux is then evaluated analytically through the usage of the Gegenbauer addition theorem once an accurate, rational approximation is used in place of the factor of the integrand that exhibits branch cuts. It is shown how the resulting explicit solution exhibits the same degree of accuracy as purely numerical approaches like the finite-difference time-domain (FDTD) method and conventional numerical quadrature schemes, while it is less time-demanding than the latter methods.

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“…Over the last decades, wireless power transfer (WPT) systems have attracted the interest of researchers working in a variety of scientific fields [1][2][3][4][5][6][7][8][9][10][11]. In fact, WPT systems find application in automotive battery [1] and consumer electronics' charging [2], in pacemaker battery charging [3], and in inductive links for low-power three-dimensional (3-D) integration systems [4]. Among all the WPT technologies, the magnetic resonance coupling (MRC) method is the one that offers better performances in terms of transfer distance and efficiency.…”

Section: Introductionmentioning

confidence: 99%

On the Flux Linkage between Pancake Coils in Resonance-Type Wireless Power Transfer Systems

Parise

Antonini

Romano

2020

International Journal of Antennas and Propagation

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This work presents a series representation for the mutual inductance of two coaxial pancake coils which remains accurate in non-quasi-static regime under the hypothesis that the current in the source coil is uniformly distributed. Making use of Gegenbauer’s addition theorem and a term-by-term analytical integration, the mutual inductance between two generic turns belonging to distinct coils is expressed as a sum of spherical Hankel functions with algebraic coefficients. The accuracy and efficiency of the resulting expression is proved through pertinent numerical examples.

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Full-wave modeling of inductive coupling links for low-power 3D system integration

Cited by 5 publications

References 14 publications

A high-speed design methodology for inductive coupling links in 3D-ICs

A high-speed design methodology for inductive coupling links in 3D-ICs

A Rigorous Explicit Expression for the Mutual Inductance of Two Co-Axial Thin-Wire Coil Antennas Placed above a Layered Ground

On the Flux Linkage between Pancake Coils in Resonance-Type Wireless Power Transfer Systems

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