A high-speed design methodology for inductive coupling links in 3D-ICs

Fletcher, Benjamin J.; Das, Shidhartha; Mak, Terrence

doi:10.23919/date.2018.8342059

Cited by 8 publications

(8 citation statements)

References 15 publications

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“…When combining these parameters (R, L, C, and M) to evaluate efficiency, the combined average error was determined to be 7.8%. This represents a 1.17× improvement upon the expressions used in [10].…”

Section: Empirical Expression Evaluation 1) R L and C Extractionmentioning

confidence: 95%

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Design and Optimization of Inductive-Coupling Links for 3-D-ICs

Fletcher

Das

Mak

2019

IEEE Trans. VLSI Syst.

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Recent research in the field of 3-D system integration has looked to the use of inductive-coupling links (ICLs) to provide vertical connectivity without incurring the inflated fabrication and testing costs associated with through-silicon vias. For power-efficient ICL design, optimization of the utilized physical inductor geometries is essential, but currently must be performed manually in a process that can take several hours. As a result, the generation of optimized inductor designs poses a significant challenge. In this paper, we address this challenge in three main contributions: 1) a novel, nonuniform planar inductor layout that exhibits enhanced performance when compared with conventional uniform inductors; 2) a rapid solver for evaluating inductor layouts; and 3) a high-speed optimization algorithm for determining best performing coil pairs. These three contributions are combined as a CAD tool for optimization of ICLs for 3-D-ICs (COIL-3-D). Results demonstrate that COIL-3-D achieves an average accuracy within 7.8% of finite-element tools consuming a small fraction of the time (1.5 × 10 −3 %), significantly ameliorating the design of ICL-based 3-D-ICs. We also demonstrate that using COIL-3-D to optimize ICL inductor layouts can yield significant performance (up to 41.5% bandwidth improvement) and power (up to 8.1% power improvement) benefits, when compared with layouts used in prior ICL implementations. For these reasons, this paper unlocks new potential for low-cost, power-efficient 3-D integration using ICLs.

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Section: Empirical Expression Evaluation 1) R L and C Extractionmentioning

confidence: 95%

“…Considering the inductor in this way facilitates more accurate evaluation than the use of single expressions and allows for accurate evaluation of the nonuniform inductors proposed in this paper. The use of this improved scalable inductor model in COIL-3-D is supplementary to [10].…”

Section: A Scalable Inductor Modelmentioning

confidence: 99%

Design and Optimization of Inductive-Coupling Links for 3-D-ICs

Fletcher

Das

Mak

2019

IEEE Trans. VLSI Syst.

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“…The popularity of these three approximation formulas is quite distinct. From the research works found in the literature, it is possible to state that the Current Sheet Approximation formula is the most used [8,[19][20][21][22][23][24]37,38], followed by the Modified Wheeler [24,30] and the Data Fitted Monomial [26,39].…”

Section: Review Of Analytical Modelsmentioning

confidence: 99%

A Fast and Precise Tool for Multi-Layer Planar Coil Self-Inductance Calculation

Faria

Marques

Ferreira³

et al. 2021

Sensors

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An open-source tool that allows for a fast and precise analytical calculation of multi-layer planar coils self-inductance, without any geometry limitation is proposed here. The process of designing and simulating planar coils to achieve reliable results is commonly limited on accuracy and or geometry, or are too time-consuming and expensive, thus a tool to speed up this design process is desired. The model is based on Grover equations, valid for any geometry. The validation of the tool was performed through the comparison with experimental measurements, Finite Element Model (FEM) simulations, and the main analytical methods usually used in literature, with errors registered to be below 2.5%, when compared to standard FEM simulations, and when compared to experimental measurements they are below 10% in the case of the 1-layer coils, and below 5% in the 2-layer coils (without taking into consideration the coil connectors). The proposed model offers a new approach to the calculation of the self-inductance of planar coils of several layers that combines precision, speed, independence of geometry, easy interaction, and no need for extra resources.

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“…The second element in the CoDAPT architecture is the inductive coupling channel itself, consisting of two coupled planar inductors. Power transmission between two stacked inductors is optimised when their layouts are congruent [11]. Therefore, two congruent square spiral inductors are considered in this paper (as square inductors offer the highest inductance per unit area [12]).…”

Section: B Inductive Channel Designmentioning

confidence: 99%

CoDAPT: A Concurrent Data And Power Transceiver for Fully Wireless 3D-ICs

Fletcher

Das

Mak

2019

2019 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE)

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Three dimensional system integration is a promising enabling technology for realising heterogeneous ICs, facilitating stacking of disparate elements such as MEMS, sensors, analogue components, memories and digital processing. Recently, research has looked to contactless 3D integration using inductive coupling links (ICLs) to provide a low-cost alternative to conventional contact-based approaches (e.g. through silicon vias) for 3D integration. In this paper, we present a novel, fully wireless, ICL architecture for Concurrent Data and Power Transfer (CoDAPT) between tiers of a 3D-IC. The proposed CoDAPT architecture uses only a single inductor for simultaneous power transmission and data communication, resulting in high area efficiency, whilst facilitating low-cost, straightforward die stacking. The proposed design is experimentally validated through full wave EM and SPICE simulation and demonstrates capability to communicate data vertically at a rate of 1.3Gbps/channel (utilising an area of only 0.052mm 2) whilst simultaneously achieving power delivery of 0.83mW, under standard operating conditions. A case study is also presented, demonstrating that CoDAPT achieves an area reduction greater than 1.7× when compared with existing works, representing an important progression towards ultra low-cost 3D-ICs through fully wireless stacking.

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A high-speed design methodology for inductive coupling links in 3D-ICs

Cited by 8 publications

References 15 publications

Design and Optimization of Inductive-Coupling Links for 3-D-ICs

Design and Optimization of Inductive-Coupling Links for 3-D-ICs

A Fast and Precise Tool for Multi-Layer Planar Coil Self-Inductance Calculation

CoDAPT: A Concurrent Data And Power Transceiver for Fully Wireless 3D-ICs

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