2013 IEEE 39th Photovoltaic Specialists Conference (PVSC) 2013
DOI: 10.1109/pvsc.2013.6744905
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Front-side Ag contacts enabling superior recombination and fine-line performance

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Cited by 9 publications
(5 citation statements)
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References 3 publications
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“…[31][32][33] Research on the conductive lines has typically focused on the conductor line microstructure throughout the firing process 34 and the interface between the screen-printed conductive lines and the emitter as a function of precursor constituents to optimize the initial electrical performance. 30,[34][35][36][37][38] The microscopic mechanisms that result in the formation of the low resistance contact between the silver conductive lines and the solar cell are still being uncovered, 28 but two prevailing models are generally accepted. One hypothesis suggests that the Ag becomes dissolved within the molten glass frit, and upon cooling down, the supersaturated solution allows large grain growth at the Si interface causing a Schottky-barrierlike boundary that acts more Ohmic as the emitter doping concentration is increased to n þþ levels.…”
Section: Mesoscale Description Of Solar Cell Interfaces and Contactsmentioning
confidence: 99%
“…[31][32][33] Research on the conductive lines has typically focused on the conductor line microstructure throughout the firing process 34 and the interface between the screen-printed conductive lines and the emitter as a function of precursor constituents to optimize the initial electrical performance. 30,[34][35][36][37][38] The microscopic mechanisms that result in the formation of the low resistance contact between the silver conductive lines and the solar cell are still being uncovered, 28 but two prevailing models are generally accepted. One hypothesis suggests that the Ag becomes dissolved within the molten glass frit, and upon cooling down, the supersaturated solution allows large grain growth at the Si interface causing a Schottky-barrierlike boundary that acts more Ohmic as the emitter doping concentration is increased to n þþ levels.…”
Section: Mesoscale Description Of Solar Cell Interfaces and Contactsmentioning
confidence: 99%
“…Cell efficiencies well above 19% have been reported for screen-printed industrial monocrystalline Si cells employing optimized POCl 3 emitters with the industry standard now pushing towards 19.5% [107,110]. Future Ag paste improvements will continue to target contacting to even lower surface concentrations while minimizing recombination losses at the metal contact.…”
Section: 212mentioning
confidence: 99%
“…Outlook for ion implantation Despite the superior doping uniformity achievable with ion implantation, convincing cell manufacturers to replace existing POCl 3 lines with expensive ion implantation systems may prove to be difficult given that the industry has moved to much more sophisticated POCl 3 emitters with efficiencies above 19% [107,110]. The limited gettering from a single sided ion implantation P process may also prove to be a challenge for the application to multicrystalline Si.…”
Section: 272mentioning
confidence: 99%
“…Early generation screen‐printable pastes contained frits based on lead‐silicate (Pb–Si–O) chemistries . The early generation lead‐silicate based metallization pastes required p‐type silicon wafers with highly doped n‐type emitters (HDE), which have a surface concentration ( N D ) = ~8 × 10 20 cm ‐3 and sheet resistivities less than 80 ohm/sq, for the metallization to have sufficiently low contact resistivity . The introduction of tellurium‐based metallization pastes significantly lowered contact resistivity.…”
Section: Introductionmentioning
confidence: 99%
“…13 The early generation lead-silicate based metallization pastes required p-type silicon wafers with highly doped n-type emitters (HDE), which have a surface concentration (N D ) =~8 × 10 20 cm -3 and sheet resistivities less than 80 ohm/sq, for the metallization to have sufficiently low contact resistivity. 14,15 The introduction of tellurium-based metallization pastes significantly lowered contact resistivity. This allowed the solar cell industry to utilize wafers with lightly doped emitters (LDE), which have N D =~1-2 × 10 20 cm -3 and sheet resistivities greater than 100 ohm/sq, and which have much lower recombination velocities and lower saturation currents, and subsequently higher solar cell efficiencies compared with HDE solar cells.…”
mentioning
confidence: 99%