Design, Automation and Test in Europe
DOI: 10.1109/date.2005.161
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Framework for Fault Analysis and Test Generation in DRAMs

Abstract: With the increasing complexity of memory behavior, attempts are being made to come up with a methodical approach that employs electrical simulation to tackle the memory test problem. This paper describes a framework of algorithms and tools developed jointly by the Delft University of Technology and Infineon Technologies to systematically generate DRAM tests using Spice simulation. The proposed Spice-based test approach enjoys the advantage of being relatively inexpensive, yet highly accurate in describing the … Show more

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Cited by 11 publications
(20 citation statements)
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“…This partially enables the adjacent row of access-transistors for a short amount of time and facilitates the leakage of charge. Second, bridges are a well-known class of DRAM faults in which conductive channels are formed between unrelated wires and/or capacitors [3,4]. One study on embedded DRAM (eDRAM) found that toggling a wordline could accelerate the flow of charge between two bridged cells [29].…”
Section: Mechanics Of Disturbance Errorsmentioning
confidence: 99%
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“…This partially enables the adjacent row of access-transistors for a short amount of time and facilitates the leakage of charge. Second, bridges are a well-known class of DRAM faults in which conductive channels are formed between unrelated wires and/or capacitors [3,4]. One study on embedded DRAM (eDRAM) found that toggling a wordline could accelerate the flow of charge between two bridged cells [29].…”
Section: Mechanics Of Disturbance Errorsmentioning
confidence: 99%
“…To mitigate Work done while at Carnegie Mellon University. disturbance errors, DRAM manufacturers have been employing a two-pronged approach: (i) improving inter-cell isolation through circuit-level techniques [22,32,49,61,73] and (ii) screening for disturbance errors during post-production testing [3,4,64]. We demonstrate that their efforts to contain disturbance errors have not always been successful, and that erroneous DRAM chips have been slipping into the field.1…”
Section: Introductionmentioning
confidence: 99%
“…Another technique that is orthogonal to those we have discussed so far is to employ memory devices that use less-tested DRAM chips. The testing performed by vendors in order to achieve a certain quality of DRAM device can add a substantial amount of cost [8], though it can increase the average reliability of DRAM devices.…”
Section: Heterogeneous-reliability Memory Systemsmentioning
confidence: 99%
“…We derive the cost of ECC DRAM, non-ECC DRAM (NoECC), and paritybased DRAM using "Added capacity" from Table 1. We estimate the cost of less-tested DRAM based on the trends shown in [8,9] and examine a range of costs for lesstested DRAM because we are not aware of any recently documented costs from vendors. Crash recovery time is based on our observations during testing and we assume that data that is written in memory for regions protected by parity and recovery (Par+R) is copied to a backup on disk every five minutes.…”
Section: B Design Space Explorationmentioning
confidence: 99%
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