The Mode I fracture toughness (K IC ) of a small-grained Si 3 N 4 was determined as a function of hot-pressing orientation, temperature, testing atmosphere, and crack length using the single-edge precracked beam method. The diameter of the Si 3 N 4 grains was <0.4 µm, with aspect ratios of 2-8. K IC at 25°C was 6.6 ± 0.2 and 5.9 ± 0.1 MPaؒm 1/2 for the T-S and T-L orientations, respectively. This difference was attributed to the amount of elongated grains in the plane of crack growth. For both orientations, a continual decrease in K IC was observed through 1200°C, to ∼4.1 MPaؒm 1/2 , before increasing rapidly to 7.5-8 MPaؒm 1/2 at 1300°C. The decrease in K IC through 1200°C was a result of grain-boundary glassy phase softening. At 1300°C, reorientation of elongated grains in the direction of the applied load was suggested to explain the large increase in K IC . Crack healing was observed in specimens annealed in air. No R-curve behavior was observed for crack lengths as short as 300 µm at either 25°or 1000°C.