Fourier transform infrared spectroscopic observation of the surface reactions during electroless copper deposition in formaldehyde based electrolyte

Oh, Youn-Jin; Chung, Chan‐Hwa

doi:10.1016/j.tsf.2006.08.003

Cited by 6 publications

(2 citation statements)

References 18 publications

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“…Electroless deposition (ELD) of metal is an essential process for metallizing insulators such as plastics and glass. This process involves simultaneous reactions of reduction of metal ions and oxidation of reducing agent in solution [1]. The advantages of ELD are low processing temperature, no requirement of vacuum system, high selectivity and uniform coating [2].…”

Section: Introductionmentioning

confidence: 99%

Electroless Copper Deposition on PET Sheets

Phasuksom

Prissanaroon-Ouajai

Brack

et al. 2013

AMR

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This paper describes metallization of PET surface by Sn-free electroless deposition (ELD) of thin copper layer. Prior to introduction to ELD process, the PET surface was plasma-pretreated in argon atmosphere. ELD is a multi-step process involving silanization with TMS, activation with PdCl2 and copper deposition. Contact angle measurement and XPS analysis were carried out at each stage in order to confirm the chemical change of the PET surface after modification. XPS analysis revealed that the copper surface consisted mainly of Cu2O, combined with Cu0, making Cu-coated PET sheet suitable for the use as substrate for electropolymerization of pyrrole. This study offers an alternative to preparing flexible sensors. This process could be further applied to micro-contact printing technique to fabricate flexible patterned electrodes.

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Section: Introductionmentioning

confidence: 99%

Electroless Copper Deposition on PET Sheets

Phasuksom

Prissanaroon-Ouajai

Brack

et al. 2013

AMR

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“…Park et al examined the reactivity of Cu ELD solution according to the types of complexing agents by using laser transmittance, and Oh et al used Fourier transform infrared spectrometry (FT-IR) to verify the reaction mechanism of Cu ELD. 11,12 We investigated the mechanism of Cu ELD by measuring the open-circuit potential (OCP) and mass change of Cu electrode. As OCP measurement used the minimum overpotential for the minimization of current flow, there is low possibility that the electrode is affected by the applied overpotential.…”

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confidence: 99%

Real-Time Observation of Cu Electroless Deposition Using OCP Measurement Assisted by QCM

Lim¹,

Park²,

Kim³

et al. 2012

J. Electrochem. Soc.

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The role of each chemical component in Cu electroless deposition (ELD) solution was investigated in real-time by open-circuit potential (OCP) measurement assisted by quartz crystal microbalance. It was observed that Cu was continuously oxidized in alkaline bath. However, when ethylenediaminetetraacetic acid (EDTA), a well-known complexing agent, was in the solution together, EDTA was found to participate in the removal of Cu oxide formed on the surface as well as the complexation of Cu ions in the solution. Formaldehyde, a reducing agent, was adsorbed onto the Cu surface and inhibited further Cu oxidation in the alkaline media. Both components maintained low oxygen content on the Cu surface in the alkaline solution. Coulometric reduction method and X-ray photoelectron spectroscopy analysis revealed that the surface had a small amount of Cu 2 O. During Cu ELD process, the induction period was observed at the initial stage of the deposition and it was related with the time that methylene glycol anions were adsorbed and became activated on the surface. The OCP measurement during Cu ELD also indicated that the deposition followed the mixed potential theory to some extent.

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Study on electrochemical mechanical polishing process of copper circuit on PCB

Kulyk

et al. 2010

Korean J. Chem. Eng.

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As an alternative to conventional chemical mechanical polishing (CMP) for the planarization of copper layers on electronic circuits, the electrochemical mechanical polishing (ECMP) process in alkali-based solution was investigated in this work. The influence of the polishing pad materials on the polishing process was studied, and the hard polyurethane polishing pad was shown to eliminate the "dishing effect". The polishing conditions, such as the pad rotating speed, concentration of H 2 O 2 , and the amount of BTA additives were optimized to control the planarization performance. As a result, good planarization uniformity was obtained not only in small scale (30 µm) trenches but also in very large scale (a few mm) patterns with a single step ECMP process.

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Fourier transform infrared spectroscopic observation of the surface reactions during electroless copper deposition in formaldehyde based electrolyte

Cited by 6 publications

References 18 publications

Electroless Copper Deposition on PET Sheets

Electroless Copper Deposition on PET Sheets

Real-Time Observation of Cu Electroless Deposition Using OCP Measurement Assisted by QCM

Study on electrochemical mechanical polishing process of copper circuit on PCB

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