Formation of zinc oxide thin film using supercritical fluids and its application in fabricating a reliable Cu/glass stack

Watanabe, Mitsuhiro; Tamekuni, Shigeaki; Kondoh, Eiichi

doi:10.1016/j.mee.2015.03.031

Cited by 2 publications

(1 citation statement)

References 18 publications

(22 reference statements)

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“…It is found that this adhesion enhancement is not influenced by the kind of glass substrate. The influence of the kind of ZnO layer on adhesion strength was examined [30,31]. ZnO layer was fabricated by sol-gel method, metal organic decomposition (MOD), and supercritical fluid chemical deposition (SFCD), and we investigated whether these ZnO layers improve the adhesion of Cu/glass stacks.…”

Section: Znmentioning

confidence: 99%

Room-Temperature Formation of Intermixing Layer for Adhesion Improvement of Cu/Glass Stacks

Watanabe¹,

Kondoh²

2019

Lead Free Solders

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Reliable and high-precision Cu/glass stacks are particularly desirable for microelectromechanical systems and packaging technologies. One solution for improving the adhesion strength of Cu/glass stacks is to form adhesion layers between the Cu films and the glass substrate. Many studies have shown that a strong adhesion layer is formed at the interface by high-temperature annealing when a Cu alloy is used instead of pure Cu. It is important to reduce the temperature and process time in order to reduce the thermal budget and fabrication cost. Therefore, the room-temperature process for fabrication of Cu/glass stack is desirable. In this chapter, typical advanced low-temperature processes including room-temperature process are introduced.

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Section: Znmentioning

confidence: 99%

Room-Temperature Formation of Intermixing Layer for Adhesion Improvement of Cu/Glass Stacks

Watanabe¹,

Kondoh²

2019

Lead Free Solders

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Improvement in Adhesion of Cu/glass Stacks using ZnO Thin Films Deposited by Chemical Solution Methods and Its Formation Conditions

Watanabe

Koike

Kondoh

2015

Journal of The Surface Finishing Society of Japan

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塗布法によって堆積した ZnO 薄膜を用いた Cu / ガラス構造の密着性向上ならびにその形成条件の検討渡邉満洋 a,* ，小池光海 b ，近藤英一 a a 山梨大学大学院総合研究部 (〒 400-8511 山梨県甲府市武田 4-3-11) b 山梨大学工学部 (〒 400-8511 山梨県甲府市武田 4-3-11)After zinc oxide (ZnO) thin films were deposited using chemical solution methods such as sol-gel method and metal organic decomposition, the deposited ZnO thin films were used as a precursor promoting adhesion in Cu/glass stack systems. Transparent ZnO thin films were deposited on a borosilicate glass substrate using chemical solution methods. X-ray diffraction and X-ray photoelectron spectroscopy analyses revealed that the deposited ZnO thin films have no specified orientation and much less carbon contamination. The obtained ZnO thin films comprised two characteristic layers: a porous structure formed at the glass substrate side and a dense layer formed at the surface side. The adhesion of Cu/glass stacks formed by the ZnO thin films increased markedly when the ZnO/glass stacks were annealed at 600 ℃. Furthermore, the adhesion increased with increasing ZnO removal time, reaching a maximum value at a certain removal time, but decreasing thereafter. These results indicate that the deposited ZnO thin films are effective for the improvement of Cu/glass stack adhesion. Results show that a Zn-doped layer formed at the glass surface plays an important role in the improvement of Cu/glass stack adhesion.

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Formation of zinc oxide thin film using supercritical fluids and its application in fabricating a reliable Cu/glass stack

Cited by 2 publications

References 18 publications

Room-Temperature Formation of Intermixing Layer for Adhesion Improvement of Cu/Glass Stacks

Room-Temperature Formation of Intermixing Layer for Adhesion Improvement of Cu/Glass Stacks

Improvement in Adhesion of Cu/glass Stacks using ZnO Thin Films Deposited by Chemical Solution Methods and Its Formation Conditions

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