Abstract:Reliable and high-precision Cu/glass stacks are particularly desirable for microelectromechanical systems and packaging technologies. One solution for improving the adhesion strength of Cu/glass stacks is to form adhesion layers between the Cu films and the glass substrate. Many studies have shown that a strong adhesion layer is formed at the interface by high-temperature annealing when a Cu alloy is used instead of pure Cu. It is important to reduce the temperature and process time in order to reduce the ther… Show more
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