2008
DOI: 10.1002/pssa.200778114
|View full text |Cite
|
Sign up to set email alerts
|

Formation of self‐assembled metal/silicon nanocomposites

Abstract: The fabrication of nanoscopic silicon based membranes has been carried out by using a non‐expensive electrochemical preparation technique. For these purposes an n+‐silicon wafer is anodized to create oriented pores with typical diameters around 50 nm. The length of the channels is up to 50 μm which yields to an aspect ratio of 1000. The channels of these templates are partially filled with a metal, especially a ferromagnetic one to obtain an array of nanostructures. Metal‐deposition within such high aspect rat… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
28
0

Year Published

2009
2009
2019
2019

Publication Types

Select...
7

Relationship

4
3

Authors

Journals

citations
Cited by 21 publications
(28 citation statements)
references
References 13 publications
0
28
0
Order By: Relevance
“…The samples exhibit a statistically distributed 3-dimensional array of precipitated metal-nanostructures. The distribution can be influenced by the electrochemical process parameters [7]. So at a certain cross-sectional level not all the pores are filled with metal-structures.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The samples exhibit a statistically distributed 3-dimensional array of precipitated metal-nanostructures. The distribution can be influenced by the electrochemical process parameters [7]. So at a certain cross-sectional level not all the pores are filled with metal-structures.…”
Section: Resultsmentioning
confidence: 99%
“…The pulsed technique with frequencies between 0.025 Hz and 0.2 Hz is utilized to avoid the exhaustion of the electrolyte within the pores which is important because the metal deposition within such high aspect ratio pores is affected by mass transfer and is a diffusion limited process. As electrolyte an aqueous metal-salt solution is used whereas as buffer boric acid is added [7]. In case of Ni-deposition a NiCl 2 -electrolyte or the so called Watts electrolyte (NiCl 2 , NiSO 4 ) are used.…”
Section: Experimental 21 Fabrication Of the Silicon/metal Compositementioning
confidence: 99%
“…In a subsequent procedure within the pores of the two layers one or two different metals are deposited. The precipitated metal nanostructures are distributed within each pore in such a way that they dipolarly couple which has been discussed in a previous work (17). …”
Section: Discussionmentioning
confidence: 96%
“…In a further electrochemical step the templates are filled with Ni or Co. The deposition is performed in using a Ni-/Co-salt solution as electrolyte and applying pulsed deposition technique to avoid the exhaustion of the electrolyte [7]. In a previous publication the dependence of the geometry as well as of the spatial distribution of the precipitations on the electrochemical parameters is presented [8].…”
Section: Methodsmentioning
confidence: 99%