Formation of oxides on copper in alkaline solution and their photoelectrochemical properties

Ganzha, S. V.; Maksimova, S. I.; Grushevskaya, S. N.; Vvedenskii, A. V.

doi:10.1134/s2070205111020080

Cited by 13 publications

(1 citation statement)

References 24 publications

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“…In addition, the thickness of cuprous oxide film formed in KOH solution was about ∼50 nm which was calculated by anodic charge. Researchers also considered that the film containing a mixture of cuprous and cupric oxides would be thicker . The cubic crystals depicted in SEM micrograph were further confirmed by XPS spectra.…”

Section: Discussionmentioning

confidence: 96%

Evaluation of hollow copper strands corrosion behavior in stator cooling water using response surface methodology

Zhang

Cao

Pan³

2018

Materials & Corrosion

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Generator hollow copper strands are frequently subjected to plug and flow restriction caused by copper oxide deposition. Response surface methodology was used to optimize the three key independent operating parameters, namely temperature, pH, and dissolved oxygen, to decrease copper corrosion. The characterization of chemical features was studied by atomic force microscopy (AFM), scanning electron microscopy (SEM), and X‐ray photoelectron spectroscopy (XPS). The optimum condition was obtained as temperature 60 °C, pH 8.5, and dissolved oxygen 0.04 mg/L. At this applied optimum condition, the corrosion rate and the content of dissolved copper ions could be lower than 0.005 mm y−1 and 25 µg/L, respectively. Increasing pH could decrease both the corrosion rate and the content of dissolved copper ions owing to enhance the height of layer and varied the composition of the film.

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Section: Discussionmentioning

confidence: 96%