The effect of ammonium sulfamate and benzotriazole on the prevention of exothermic conditions, the evolution of toxic NO x gases and the reduction of copper attack during solder stripping were studied. The effect of these additives on the rate of temperature rise for solutions treating 63Sn37Pb solder alloy and pure copper were investigated. Weight loss analysis was also performed in order to evaluate the rate of copper etching in various compositions. Scanning electron microscopy was employed to investigate the nature of the attack on the copper surface. In order to identify the role of ammonium sulfamate and benzotriazole on the stripping process, anodic polarization measurements were performed for the copper electrodes. The results revealed that ammonium sulfamate is capable of eliminating the reduction of nitric acid and the evolution of toxic NO x gases, can prevent excessive temperature rise, and can inhibit the rate of copper etching. On the other hand, benzotriazole is capable of providing a mirror bright copper surface after the solder stripping. Simultaneous addition of ammonium sulfamate and benzotriazole to the stripping solution led to a unique solder stripping composition which is substantially secure in terms of the temperature rise, evolution of toxic NO x gases and copper attack.