2015
DOI: 10.1016/j.commatsci.2015.04.009
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Formation of multiple dislocations in Si solid-phase epitaxy regrowth process using stress memorization technique

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Cited by 2 publications
(2 citation statements)
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References 12 publications
(17 reference statements)
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“…The simulation time for annealing at 1400 K is 1000 ns, which is much larger than that performed by others. [2][3][4][5][6]8,9) It is apparent that the volume of the crystal region increases with annealing temperature and time. Although the a=c interface was flat initially, it became rough with the progress of SPE.…”
Section: Growth Processes and Activation Energy Of Spe Recrystallizationmentioning
confidence: 99%
See 1 more Smart Citation
“…The simulation time for annealing at 1400 K is 1000 ns, which is much larger than that performed by others. [2][3][4][5][6]8,9) It is apparent that the volume of the crystal region increases with annealing temperature and time. Although the a=c interface was flat initially, it became rough with the progress of SPE.…”
Section: Growth Processes and Activation Energy Of Spe Recrystallizationmentioning
confidence: 99%
“…Indeed, the simulations of SPE growth for amorphous Si have been performed so far by several researchers, as summarized in Table I. [1][2][3][4][5][6][7][8][9] Bernstein et al 1) examined the SPE processes of ∼2000 Si atoms using the environment-dependent interatomic potential. From the Arrhenius plot of the growth rates, they found that the activation energy of the SPE growth changes at 950 K: 0.4 ± 0.2 eV below 950 K and 2.0 ± 0.5 eV above 950 K. On the contrary, Motooka et al 2) reported an opposite behavior, based on the MD simulations using 4096 Si atoms interacting via the Tersoff potential: 2.7 eV at the lower temperature region (1450-1600 K) and 1.2 eV at the higher temperature region (1600-2000 K).…”
Section: Introductionmentioning
confidence: 99%