Formation of microbeads during vapor explosions of Field's metal in water

Kouraytem, Nadia; Li, Erqiang; Thoroddsen, Sigurður T.

doi:10.1103/physreve.93.063108

Cited by 27 publications

(7 citation statements)

References 35 publications

(37 reference statements)

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“…The surface tension water-metal measurement was achieved at a droplet contact temperature of 75 • C (q.v.). The value that we obtained is similar to the value obtained by Kouraytem et al 25 and this may be related to similar operating conditions and a very small sensitivity to temperature (usually 23 dγ/dT ≈ 10 −4 − 10 −3 N.m −1 .K −1 and the surface tension of metal is relatively high and our variations of temperature are relatively small).…”

Section: A Materialssupporting

confidence: 90%

Fragmentation of a liquid metal droplet falling in a water pool

et al. 2021

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HAL is a multi-disciplinary open access archive for the deposit and dissemination of scientific research documents, whether they are published or not. The documents may come from teaching and research institutions in France or abroad, or from public or private research centers. L'archive ouverte pluridisciplinaire HAL, est destinée au dépôt et à la diffusion de documents scientifiques de niveau recherche, publiés ou non, émanant des établissements d'enseignement et de recherche français ou étrangers, des laboratoires publics ou privés.

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Section: A Materialssupporting

confidence: 90%

Fragmentation of a liquid metal droplet falling in a water pool

et al. 2021

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“…A wide spectrum in the fragmentation time scale of ≈ 1.2 to 2.5 ms can be inferred from the results which is rather higher than the fragmentation time scale of 0.6 ms to 1.2 ms inferred from Ciccareli-Frost experiments with tin drops at varied melt-water relative velocities [2]. However, a general trend of an increase in fine fragmentation time at an increased superheat is observed which is also consistent with the observations made in [16], where a larger superheat tends to involve multiple cycles of explosion. The observations indicate that a larger fraction of the melt can be involved in the vapor explosion at a higher degree of melt superheat.…”

Section: Effect Of Melt Superheatsupporting

confidence: 81%

An experimental study on the intense heat transfer and phase change during melt and water interactions

Manickam

Guo

et al. 2018

Experimental Heat Transfer

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Accidental contact between hot melt and cold water poses fatal hazard in several industries. Vapor explosion during melt-water contact in nuclear power plant accident can result in catastrophic containment failure. The fast transient phenomena as vapor explosion is not comprehensively understood despite several advances in research. It is not clear why certain parameters of melt and water exhibit differences in fragmentation behavior. To examine the influential parameters, we perform a series of experiments. The interactions between melt and water is visualized by high-speed video and X-ray radiograph.ARTICLE HISTORY

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“…The typical viscosity and surface tension of the molten Field's Metal ink are around 20 mPa‐s and 410 mN m −1 . [ 45,46 ] Due to the large surface tension of the molten metal ink, direct extrusion without printing voltage is very difficult to produce high resolution features. Under the pure pneumatic pressure, the molten metal tended to form a droplet that was at millimeter scale and much larger than the nozzle size, because of its large surface tension, as shown in Figure 1b.…”

Section: Resultsmentioning

confidence: 99%

Direct Fabrication of VIA Interconnects by Electrohydrodynamic Printing for Multi‐Layer 3D Flexible and Stretchable Electronics

Ren

Dong

2021

Adv Materials Technologies

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Multi‐layer electrical interconnects are critical for the development of integrated soft wearable electronic systems, in which functional devices from different layers need to be connected together by vertical interconnects. In this work, electrohydrodynamic (EHD) printing technology is studied to achieve multi‐layer flexible and stretchable electronics by direct printing vertical interconnects as vertical interconnect accesses (VIAs) using a low‐melting‐point metal alloy. The EHD printed metallic vertical interconnection represents a promising way for the direct fabrication of multilayer integrated electronics with metallic conductivity and excellent flexibility and stretchability. By controlling the printing conditions, vertical interconnects that can bridge different heights can be fabricated. To achieve reliable VIA connections under bending and stretching conditions, an epoxy protective structure is printed around the VIA interconnects to form a core‐shell structure. A stable electrical response is achieved under hundreds of bending cycles and during stretching/releasing cycles in a large range of tensile strain (0–40%) for the printed conductors with VIA interconnects. A few multi‐layer devices, including a multiple layer heater, and a pressure‐based touch panel are fabricated to demonstrate the capability of the EHD printing for the direct fabrication of vertical metallic VIA interconnects for flexible and stretchable devices.

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Formation of microbeads during vapor explosions of Field's metal in water

Cited by 27 publications

References 35 publications

Fragmentation of a liquid metal droplet falling in a water pool

Fragmentation of a liquid metal droplet falling in a water pool

An experimental study on the intense heat transfer and phase change during melt and water interactions

Direct Fabrication of VIA Interconnects by Electrohydrodynamic Printing for Multi‐Layer 3D Flexible and Stretchable Electronics

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