Formation of double‐surface‐silvered polyimide films via a direct ion‐exchange self‐metallization technique: The case of BPADA/ODA and [Ag(NH₃)₂]⁺

Abstract

Double‐surface‐silvered polyimide (PI) films have been successfully fabricated via a direct ion‐exchange self‐metallization method using silver ammonia complex cation ([Ag(NH3)2]+) as silver resource and bis[4‐(3,4‐dicarboxyphenoxy)phenyl]propane dianhydride/4,4′‐oxydianiline (BPADA/ODA)‐based poly(amic acid) (PAA) as the PI precursor. The alkaline characteristic of the silver precursor dramatically improves the efficiency of the ion exchange and film metallization process. By using an aqueous [Ag(NH3)2]+ solution with a concentration of only 0.01M and an ion‐exchange time of only 5 min, metallized films with desirable performance could be easily obtained by simply heating the silver(I)‐doped PAA films to 300°C. The strong hydrolysis effect of the basic [Ag(NH3)2]+ cations on the flexible and acidic BPADA/ODA PAA chains was observed during the ion exchange process by the quantitative evaluation of the mass loss of PAA matrix. Nevertheless, under the present experimental conditions, the final metallized film essentially retained the basic structural, thermal, and mechanical properties of the pristine PI, which make it a truly applicable material. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012

Plasmon Active Functional Coatings with Hybrid Bimetallic Nanoparticles@Polymers by a Single Step Photoinduced Approach

“…With this in mind, for the first formulation (Ag@Au), and in order to partially neutralize the formation of AgCl when Ag + reacts with the [AuCl 4 ] − complexes (eq ), a small amount of NH 3(l) (25 μL) was added to the AgNO 3 solution. The resulting ammine complexes [Ag­(NH 3 ) 2 ] + (eq ) , show increased reactivity with respect to AgCl. This complex can then be reduced into Ag(0) more favorably than AgCl (s) (Table ).…”

Realization of electromagnetic shielding performance for polyimide-matrix composite by self-metallization

“…19–21 In another reported method called direct ion exchange self-metallization (DIESM), only the surface of the damp-dry PAA film was loaded with Ag + by Ag + /PAA surface ion exchange followed by thermal treatment, which avoids the detriment of the Ag + to the PI bulk. 22–28 However, these studies are mainly focused on thermoplastic PIs without endcappers. For a thermosetting PI with crosslinking endcappers, a new set of method must be founded to realize its surface metallization and bulk integrity.…”

Fabrication and characterization of polyimide/Al2O3 composite films via surface modification and ion exchange technique

“…carboxyl groups) and the subsequent incorporation of metal ions via ion exchange reaction. The subsequent thermal treatment of the metal ion-loaded PI films induces the reduction of metal ions to provide metal surfaces without the addition of an external reducing agent (Stephans et al, 2000;Lin et al, 2012;Han et al, 2013aHan et al, , 2013b. The major advantage of this surface modification and ion-exchange technique is that the microstructures of the composites, the thickness of the metal layers and interparticle spacing of the dispersed inorganic particles can be controlled systematically by the initial alkali treatment and subsequent ion-exchange conditions (concentration, time and temperature), as well as by the final thermal treatment procedure.…”

“…This method has other advantages, such as processing simplicity, low cost and environment friendly (Mu et al, 2010b). Using this method, many PI/metal or PI/metal oxide composites have been prepared, including PI/Ag (Han et al, 2012;Lin et al, 2012;Qi et al, 2006Qi et al, , 2008Qi et al, , 2007aAkamatsu et al, 2011;Akamatsu et al, 2003a;Han et al, 2013aHan et al, , 2013bQi et al, 2007b), PI/ZnO (Mu et al, 2011;Ding et al, 2013), PI/ CuO (Zhan et al, 2012;Akamatsu et al, 2003b), PI/Co 3 O 4 (Mu et al, 2010a(Mu et al, , 2010b, PI/NiO (Mu et al, 2009) and PI/SnO 2 (Cui et al, 2011). The aim of this study was to prepare PI/Al 2 O 3 composite films via a surface modification and ion-exchange techniques and examine their properties.…”