2022 IEEE 12th International Conference Nanomaterials: Applications &Amp; Properties (NAP) 2022
DOI: 10.1109/nap55339.2022.9934303
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Formation of Copper Coating on Polymer Granules by Chemical Method

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“…The further reduction of copper ions by formaldehyde is an autocatalytic process and occurs on the formed copper surface. This ensures the formation of a copper coating on the surface of the polyethylene granule, the thickness of which can be adjusted by the parameters of the metallization process (concentration of the components of electroless copper plating solution, duration of metallization, the number of repeated metallizations) [33][34][35]. The composition of the electroless copper plating solution is as follows (mmol/L):…”
Section: Methodsmentioning
confidence: 99%
“…The further reduction of copper ions by formaldehyde is an autocatalytic process and occurs on the formed copper surface. This ensures the formation of a copper coating on the surface of the polyethylene granule, the thickness of which can be adjusted by the parameters of the metallization process (concentration of the components of electroless copper plating solution, duration of metallization, the number of repeated metallizations) [33][34][35]. The composition of the electroless copper plating solution is as follows (mmol/L):…”
Section: Methodsmentioning
confidence: 99%