“…In order to achieve defectivity levels similar to that of dry lithography, an enormous effort was directed toward identifying, classifying, and determining the root cause of various defects associated with immersion lithography. ,,,,,,,,,− As shown in Figure , typical defects can be classified into nonimmersion defects (particles, microbridging, and coating defects) and immersion-related defects (air bubbles, topcoat blister/resist swelling, drying stains, and watermarks). Since the mechanisms of defect formation in 193 nm immersion lithography and process-related defect reduction strategies have been recently reviewed by Wei and Brainard, , only a brief overview will be presented here.…”