Advances in Resist Materials and Processing Technology XXV 2008
DOI: 10.1117/12.771221
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Formation mechanism of 193nm immersion defects and defect reduction strategies

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Cited by 4 publications
(5 citation statements)
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“…So far, it has been shown that nanobubbles contribute to the attraction between hydrophobic surfaces in water [1][2][3], rupture of thin liquid films [37,38], and hydrodynamic slip [29]. Moreover, they play a role in froth-flotation [39], immersion lithography [40], and are a useful tool for cleaning surfaces fouled with proteins or nanoparticles [41,42].…”
Section: Introductionmentioning
confidence: 99%
“…So far, it has been shown that nanobubbles contribute to the attraction between hydrophobic surfaces in water [1][2][3], rupture of thin liquid films [37,38], and hydrodynamic slip [29]. Moreover, they play a role in froth-flotation [39], immersion lithography [40], and are a useful tool for cleaning surfaces fouled with proteins or nanoparticles [41,42].…”
Section: Introductionmentioning
confidence: 99%
“…In order to achieve defectivity levels similar to that of dry lithography, an enormous effort was directed toward identifying, classifying, and determining the root cause of various defects associated with immersion lithography. ,,,,,,,,, As shown in Figure , typical defects can be classified into nonimmersion defects (particles, microbridging, and coating defects) and immersion-related defects (air bubbles, topcoat blister/resist swelling, drying stains, and watermarks). Since the mechanisms of defect formation in 193 nm immersion lithography and process-related defect reduction strategies have been recently reviewed by Wei and Brainard, , only a brief overview will be presented here.…”
Section: Materials For 193 Nm Water Immersion Lithographymentioning
confidence: 99%
“…Microbridging between lines is a nonimmersion-specific defect typically attributed to resist nonuniformity (e.g., gels) or BARC defects, which may generally be reduced by proper filtration . Microbridging defects also increase as the resolution is pushed beyond the capability of the original dry photoresist .…”
Section: Materials For 193 Nm Water Immersion Lithographymentioning
confidence: 99%
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