Advances in Patterning Materials for 193 nm Immersion Lithography

Review on Micro- and Nanolithography Techniques and their Applications

“…Photolithography has been the main workhorse in the semiconductor and IC industry [1][2][3][4][5][6][7][8][9][10]. It has been employed for pattern generation in manufacturing of ICs, microchips and commercial MEMS devices.…”

“…Thus, it is employed in manufacturing of advanced ICs and CPU chips. In recent years, immersion lithography [8], resolution enhancement technology [9] and extreme-UV lithography [10] have been developed to improve the lithography resolution of projection printing. …”

“…Masked lithography makes use of masks or molds to transfer patterns over a large area simultaneously, thus, enabling a high-throughput fabrication up to several tens of wafers/hr. The forms of masked lithography include photolithography [1][2][3][4][5][6][7][8][9][10], soft lithography [11][12][13], and nanoimprint lithography [14][15][16][17][18][19][20][21]. On the other hand, maskless lithography, such as electron beam lithography [22][23][24][25][26][27][28][29], focused ion beam lithography [30][31][32][33], and scanning probe lithography [34][35][36][37][38][39][40][41][42][43][44], fabricates arbitrary patterns by a serial writing without the use of masks.…”

Drops on soft surfaces learn the hard way

“…This aphysical prediction is only resolved by noncontinuum, molecular effects, causing contact line dynamics to depend strongly on minute variations in local chemistry or topography. Contact line pinning is, thus, common and plays a key role in coffeering stains (19,20), the hysteresis of dynamic contact angles, and in wetting instabilities that ultimately limit the speed with which microchips can be produced via immersion lithography (21). Viscoelastic deformations of soft substrates-strongest around the contact line itself (Fig.…”

Alternative lithography strategies for flexible electronics

“…The factor κ1 is a process-dependent parameter that is determined by illumination conditions, mask technology, and photoresist capabilities with a lower limit of 0.25 for single-exposure optical lithography. [67] (2.1)…”