Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points

Kaltwasser, Mahsa; Schmidt, Udo; Lösing, Lars; Biswas, Shantonu; Stauden, Thomas; Bund, Andreas; Jacobs, Heiko O.

doi:10.1038/s41598-019-47690-8

Cited by 11 publications

(9 citation statements)

References 21 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The results of their collaboration where first presented for flat substrates. [ 77 ] Then, a functional roll‐to‐roll system was demonstrated in ref. [78].…”

Section: New Enabling Technologies For Micro Cpvmentioning

confidence: 99%

“…The dimensions of the LED dies used in the roll‐to‐roll FSA are similar to micro‐CPV solar cells, and the solder bumps tailored for this process also meet the thermal budget for micro‐cell assembly, which involve a low temperature of 75 °C for the FSA process. [ 77 ] Single junction 1000 mm sided GaAs solar cells were successfully assembled using FSA to create a micro‐CPV module. Up to 256 solar cells could be assembled at the same time on a 40 × 40 mm 2 PCB.…”

Section: New Enabling Technologies For Micro Cpvmentioning

confidence: 99%

“…This high yield makes this a viable approach for the industry and an attractive solution for micro-CPV which uses similar sizes of dies. Reproduced with permission [77]. Copyright 2019, Springer Nature Limited.…”

mentioning

confidence: 99%

See 2 more Smart Citations

Integrated Micro‐Scale Concentrating Photovoltaics: A Scalable Path Toward High‐Efficiency, Low‐Cost Solar Power

Jost

Juejun

et al. 2023

Solar RRL

View full text Add to dashboard Cite

The global energy market is seeing increases in the electricity demand of a couple of percentage points annually. The photovoltaic (PV) industry is also growing rapidly every year. One of the PV technologies is concentrator photovoltaics (CPV). CPV uses high‐efficiency multijunction solar cells and optics to concentrate sunlight, thereby significantly reducing the amount of semiconductor material needed. Yet, due to the high upfont manufacturing cost of CPV, it currently does not offer a competitive price against silicon PV. With this a new branch is introduced to the industry, micro‐CPV, which can be broadly explained as the miniaturization of the solar cells and optical components. The motivation for micro‐CPV is lowering the cost by decreasing the material volume and enabling new system architectures and high‐throughput manufacturing methods, while still maintaining high electrical efficiencies, taking advantage of a lower thermal load, shorter optical paths, lower resistive losses, and lower material volumes. Herein, a comprehensive review of the technological advances is presented, key synergies between micro‐CPV and other industries sharing similar challenges are identified, exemplified by micro‐light emitting diodes display manufacturing. New assembly process development in these industries will facilitate commercial adoption of micro‐CPV with continued miniaturization while driving down the cost.

show abstract

“…The results of their collaboration where first presented for flat substrates. [ 77 ] Then, a functional roll‐to‐roll system was demonstrated in ref. [78].…”

Section: New Enabling Technologies For Micro Cpvmentioning

confidence: 99%

Section: New Enabling Technologies For Micro Cpvmentioning

confidence: 99%

See 1 more Smart Citation

Integrated Micro‐Scale Concentrating Photovoltaics: A Scalable Path Toward High‐Efficiency, Low‐Cost Solar Power

Jost

Juejun

et al. 2023

Solar RRL

View full text Add to dashboard Cite

show abstract

“…microLEDs are positioned and oriented by shape recognition and surface tension-driven self-alignment. Shape recognition is achieved through complementary shapes (pits) of microLEDs on the receiver substrate [222,223]. Thus, as shown in figure 12(b), only microLEDs with specific shapes, such as a round shape with a 160 µm radius, can be adaptable for shape recognition.…”

Section: Fluid Self-assemblymentioning

confidence: 99%

Mass transfer techniques for large-scale and high-density microLED arrays

Chen

Bian

et al. 2022

Int. J. Extrem. Manuf.

View full text Add to dashboard Cite

Inorganic-based micro light-emitting diodes (microLEDs) offer more fascinating properties and unique demands in next-generation displays. However, the small size of microLED chip (1~100 µm) makes it extremely challenging for high efficiency and low cost to accurately, selectively integrate millions of microLED chips. Recent impressive technological advances have overcome the drawbacks of traditional pick-and-place techniques when they were utilized in the assembly of microLED display, including the most broadly recognized laser lift-off technique, contact µTP technique, laser non-contact µTP technique, and self-assembly technique. Herein, we firstly review the key developments in mass transfer technique and highlight their potential value, covering both the state-of-the-art devices and requirements for mass transfer in the assembly of the ultra-large-area display and virtual reality glasses. We begin with the significant challenges and the brief history of mass transfer technique, and expand that mass transfer technique is composed of two major techniques, namely, epitaxial Lift-off technique and pick-and-place technique. The basic concept and transfer effects for each representative epitaxial Lift-off and pick-and-place technique in mass transfer are then overviewed separately. Finally, the potential challenges and future research directions of mass transfer are discussed.

show abstract

“…Kaltwasser et al have described the formation of solder bumps via sequential, multilayer electroplating of base metals a, b, and c [66]. As indicated in Figure 10, the two outer metal layers, a and b (e.g., bismuth and indium) form the low melting point solder shell.…”

Section: Cu-in-bi-sn As Solder Bump Interconnects For Electronic Circ...mentioning

confidence: 99%

The continued development of multilayered and compositionally modulated electrodeposits

Walsh

2022

Transactions of the IMF

View full text Add to dashboard Cite

Traditionally, electroplating has involved the continuous deposition of a single layer of metal at constant current. However, electrodeposition of alternate layers can offer benefits such as reduced wear, improved corrosion resistance and higher tensile strength. The alternate layers can involve different morphology or thickness of metal, different metals or the alloy composition of layers with and without included particles. In the case of a single bath, electrocrystallisation is continuous but layers can be tailored to have different chemical composition, phase composition, morphology and microstructure. The composition of layers can also be systematically modified in a gradient fashion. The thickness of each metal layer can vary from >20 m down to ≈ 1 nm; in the case of nanometre thick layers, up to 500 layers of 1 nm thick individual layers might be involved. Compact multilayer deposition from a single bath is often achieved by applying a potential waveform in the laboratory or pulsed current in industry. While multilayer electrodeposition is going through a phase of rediscovery, growth and diversification, the field can be traced back to a patent involving Cu-Ni multilayers, in 1905. Progress in multi-layered electrodeposition has made use of contemporary trends in electroplating research, including self-assembled layers, nanowire arrays and the use of deep eutectic solvents for electrolytes. The developing uses of multilayer deposits are seen to span industries as diverse as wear and corrosion resistant coatings, toolbits and heavy engineering. Speciality uses include electronic, optical and magnetic materials as well as catalytic electrode surfaces for electrochemical technology. Recommendations are made on aspects which deserve further R & D.

show abstract

Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points

Cited by 11 publications

References 21 publications

Integrated Micro‐Scale Concentrating Photovoltaics: A Scalable Path Toward High‐Efficiency, Low‐Cost Solar Power

Integrated Micro‐Scale Concentrating Photovoltaics: A Scalable Path Toward High‐Efficiency, Low‐Cost Solar Power

Mass transfer techniques for large-scale and high-density microLED arrays

The continued development of multilayered and compositionally modulated electrodeposits

Contact Info

Product

Resources

About