Fluid flow and heat transfer in liquid cooled foam heat sinks for electronic packages

Zhang, H.Y.; Pinjala, D.; Joshi, Yogendra; Wong, Teck Neng; Toh, K.C.; Iyer, M.K.

doi:10.1109/tcapt.2005.848528

Cited by 49 publications

(30 citation statements)

References 16 publications

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“…However, the pumping power required is also increased due to the large pressure drop as fluid across the fin arrays. In parallel with the fin array, the use of metal foam as the heat dissipation material in the heat sink also received much attention in recent development of heat sink (Zhang et al 2005;Boomsma and Poulikakos 2002;Hwang et al 2002;Hsieh et al 2004). According to these studies, heat transfer enhancement in the metal foam heat sink can be attributed to several factors such as enlarged surface area inherent in the porous structure, presence of high thermal conductivity matrix and enhanced interstitial heat transfer coefficient due to the tortuous flow path in porous media.…”

Section: Introductionmentioning

confidence: 99%

Experimental study of heat sink performance using copper foams fabricated by electroforming

et al. 2009

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In this study, performance of heat sinks using the copper foams as heat-sinking material is investigated experimentally. The copper foam is fabricated by electroforming technique using polymer foam with pre-coated silver film as the precursors. The manufactured copper foams have the porosity, pore density (pore per inch, PPI), permeability and inertial coefficient in the ranges of 0.5-0.8, 10-40, 0.6-2 x 10(-9) m(2) and 1.5-3, respectively. Besides the copper-foam heat sink, performances of single-channel, plate-fin and pin-fin heat sinks are also investigated and compared with copper-foam heat sinks. The experimentally measured results show that the thermal resistances of copper-foam heat sinks are better than the single-channel, plate-fin and pin-fin heat sinks because of special flow features inside the porous media, enlarged heat-transfer area and enhanced heat transfer coefficient. Detail comparisons between the results of copper-foam heat sinks indicate that the thermal resistance of copper-foam heat sink decreases with the decrease in porosity and increase in pore density. The pressure drop crossing the copper-foam heat sink increases with the increase in pore density and decrease in porosity

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Section: Introductionmentioning

confidence: 99%

Experimental study of heat sink performance using copper foams fabricated by electroforming

et al. 2009

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“…[4] Over the past ten years the method has been reinvented by various groups. Mainly open cell foams on the basis of highly alloyed steels were produced, [5][6][7][8] but also foams on the basis of copper [9] or titanium alloys for the use as permanent biomedical implant [10] or low alloyed steel for degradable implants [11] were investigated. In the present work, open cell metal foams have been developed on the basis of various steels like SUS 316L, SUS 314, 4110, SUS 430L, FeCrAl, mild steels and non-ferrous metals like molybdenum, tantalum and the titanium alloy Ti6Al4V.…”

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confidence: 99%

Structural and Material Design of Open‐Cell Powder Metallurgical Foams

et al. 2011

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Open cell foams made on the basis of reticulated polyurethane foams are well known and widely used since decades. Polyurethane foams have been commercially produced since the 1950 s. [1] They are a practically ideal porous organic structure with porosities between 97 and 98%. First attempts to transfer these structures into ceramic foams by a powder slurry replication technique have been described by Schwartzwalder in 1961, [2] and nowadays such foams are produced in the order of 160 million parts per year for the use as filter in the cast shop. The replication technique has been transferred into the manufacturing of metal foams for the first time in 1966 in order to use them as porous battery electrodes. [3] In the 1970 s, notable work has been done by Russian research groups, where metal foams made by replication method were mainly used in catalysis or filtration applications. [4] Over the past ten years the method has been reinvented by various groups. Mainly open cell foams on the basis of highly alloyed steels were produced, [5][6][7][8] but also foams on the basis of copper [9] or titanium alloys for the use as permanent biomedical implant [10] or low alloyed steel for degradable implants [11] were investigated. In the present work, open cell metal foams have been developed on the basis of various steels like SUS 316L, SUS 314, 4110, SUS 430L, FeCrAl, mild steels and non-ferrous metals like molybdenum, tantalum and the titanium alloy Ti6Al4V. The present paper shows the main properties and applications of replicated PU based metal foams. ExperimentalThe replication method essentially involves three production steps: First, a reticulated polyurethane sponge is coated by slurry impregnation. Reticulated polyurethane foam samples with cell sizes of 10, 30, 45, 60, and 80 pores per inch (Foampartner Reisgies, Germany) were coated using double rubber rollers. Water-based slurries with PVA-binder or carbon acid binder and solids content between 87 and 90% were used. In the next step, the template is thermally removed and finally the debinded metal structure is sintered.Thus, the open network of the polymer foam is transformed into a metal structure. The processing in principle is rather simple, but however, in order to obtain defect-free structures with optimum properties every single processing step needs for proper development. Firstly, in order to obtain complete impregnation of the PU foams fine metal powders High porosity permeable materials have been manufactured on the basis of the highly uniform structure of foamed polyurethane since the 1950 s. This paper shows the development of open cell foams based on all kinds of steels, titanium alloys, and also open-cell molybdenum foams made by a powder metallurgical replication technique. Such materials show a wide range of physical and mechanical properties, which may be adapted to various requirements. The automotive industry, for example, needs high-temperature resistant materials with high permeability and good strength for catalytic conversion. For orthopaed...

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“…Without compromising processing speed, the integration of multi-chips in one interposer on the package tends to generate higher heat density, which needs to be addressed in the 2.5D or 3D package design. [102][103][104][105][106][107][108][109][110][111][112][113][114][115] A schematic of the cooling concepts is illustrated in Figure 50.…”

Section: Thermal Considerations Of 25d Packagesmentioning

confidence: 99%