2011
DOI: 10.7567/jjap.50.106501
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Flow Analysis of Photoresist Spray Coating towards Improving Coverage on Three-Dimensional Structures

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Cited by 8 publications
(2 citation statements)
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“…Controlling the spray flow is indispensable to achieve the uniform resist deposition. The gas flow was numerically analyzed to reveal the physics of photoresist spray coating [3,4]. The photoresist was spray-coated under the improved conditions.…”
Section: Photoresist Spray Coating and Angled Exposurementioning
confidence: 99%
“…Controlling the spray flow is indispensable to achieve the uniform resist deposition. The gas flow was numerically analyzed to reveal the physics of photoresist spray coating [3,4]. The photoresist was spray-coated under the improved conditions.…”
Section: Photoresist Spray Coating and Angled Exposurementioning
confidence: 99%
“…The atomized droplet diameter and distribution directly affect the reliability of chipintegrated circuits, as well as the yield and performance of devices. [2][3][4] The conventional spin coating cannot be applied to non-flat wafers because the microstructures on wafers will impede the radial flow of photoresists. Ultrasonic atomization forces the liquid through a small orifice, causing blockage problems, and cannot produce concentrated and small droplets.…”
Section: Introductionmentioning
confidence: 99%