Flip-chip-on-board (FCOB) assembly and reliability

Yegnasubramanian, S.; Deshmukh, Rohit; Fulton, J. P.; Fanucci, R.; Gannon, J.; Morris, John R.; Nikmanesh, K.

doi:10.1109/iemt.1997.626870

Cited by 4 publications

(2 citation statements)

References 6 publications

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“…6. As a typical chip size package (CSP), the unique interconnect structure of FCOB can greatly minimize the weight and cost of the whole system (Lau 2000;Yegnasubramanian et al 1997). The interconnect metallurgy of the FCOB technology comprises gold bumps on the ceramic chip pads and the stencil printed 63Pb/37Sn bumps on the FR4 substrate.…”

Section: Fabrication and Packaging Of The Sensormentioning

confidence: 99%

A FCOB packaged thermal wind sensor with compensation

et al. 2010

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A two dimensional wind sensor was designed, fabricated and packaged on ceramic substrate instead of silicon substrate. The Ti/Pt heater and thermistors were fabricated using single lift-off process. The gold bumps were then sputtered and patterned on the chip using lift-off process again. Correspondingly, the Pb/Sn bumps were fabricated on the FR4 substrate using stencil printing method after metallization. The sensor chip was flip-chip packaged on the FR4 substrate, and the gap was filled with epoxy-based underfill to improve the structure strength. The packaged sensor was tested in wind tunnel in constant power mode. The wind velocity and direction offsets of the sensor were compensated using software and hardware calibration. Both the simulation and test results show that the thermal wind sensor can measure wind speeds up to 8 m/s with an accuracy of 0.3 m/s, and wind direction in a full range of 360°with a resolution within 5°.

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Section: Fabrication and Packaging Of The Sensormentioning

confidence: 99%

A FCOB packaged thermal wind sensor with compensation

et al. 2010

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“…The same package may include measurement electronics and sensors (Tummala, 2004). Both size and weight can be reduced using non-packaged components joined directly to the substrate using direct chip attachment (DCA) methods (Yegnasubramanian et al, 1997). Flip-chip technology is an area saving and reliable DCA method, and was used in this study.…”

Section: Introductionmentioning

confidence: 99%

Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective

Kokko

Harjunpää²,

Haltia³

et al. 2009

Soldering &Amp; Surface Mount Technology

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If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -The purpose of this paper is to study epoxy and parylene C-coated samples. These coatings are used to protect the electronic devices from harsh environments. The effect of these conformal coatings on electronics reliability is considered. Design/methodology/approach -Epoxy coating is applied using dip coating and parylene C is applied with the vapour deposition polymerisation method. Test chip used is joined using flip-chip technology and an anisotropically conductive adhesive. Reliability of the test samples is evaluated in a constant humidity test, where test conditions are 858C and 85%RH. The test lasts 4,000 h. Failure analysis is carried out by cross-sectioning failed samples and using scanning electron microscopy for closer analysis. Findings -The results show variation in the reliability of adhesive joints with different conformal coating materials. Failure analysis highlights explicit failure mechanisms. Adhesion testing is also carried out on the test samples after constant humidity testing. The results of these reliability tests indicate clearly that parylene C is a more reliable choice of conformal coating than epoxy. Originality/value -The paper shows the influence of certain conformal coatings on the reliability of adhesive flip-chip joints. In medical applications, reliability plays an important role.

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Flip-chip on board packaging of a thermal wind sensor

Shen

Qin

Huang

et al. 2008

2008 International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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A two dimensional wind sensor was designed, fabricated and packaged on ceramic substrate instead of silicon substrate. The Ti/Pt heater and thermistors were fabricated using single lift-off process. The gold bumps were then sputtered and patterned on the chip using lift-off process again. Correspondingly, the Pb/Sn bumps were fabricated on the FR4 substrate using stencil printing method after metallization. The sensor chip was flip-chip packaged on the FR4 substrate, and the gap was filled with epoxy-based underfill to improve the structure strength and thermal isolation. The wind velocity and direction offsets of the sensor were analyzed and compensated using software and hardware calibration. The packaged sensor was tested in wind tunnel in constant power mode. Both the simulation and test results show that the thermal wind sensor can measure wind speeds up to 10m/s with an accuracy of 0.5m/s, and wind direction in a full range of 360° with a resolution within 5°.

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Flip-chip-on-board (FCOB) assembly and reliability

Cited by 4 publications

References 6 publications

A FCOB packaged thermal wind sensor with compensation

A FCOB packaged thermal wind sensor with compensation

Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective

Flip-chip on board packaging of a thermal wind sensor

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