1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)
DOI: 10.1109/ectc.1998.678689
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Flip chip equipment for high end electro-optical modules

K. Cooper1,
Ruimin Yang2,
Jean-Stephane Mottet3
et al.
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Cited by 6 publications
(1 citation statement)
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“…This flip chip bonder has been employed in numerous bonding situations ranging from quartz test slides to functional PLC's [19]. Alignment deviation in X and Y was 1 micron at 3 sigma.…”
Section: Bonding Resultsmentioning
confidence: 99%

High accuracy machine automated assembly for opto electronics

Lecarpentier1,
Mottet2,
Dumas3
et al.
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)
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“…This flip chip bonder has been employed in numerous bonding situations ranging from quartz test slides to functional PLC's [19]. Alignment deviation in X and Y was 1 micron at 3 sigma.…”
Section: Bonding Resultsmentioning
confidence: 99%

High accuracy machine automated assembly for opto electronics

Lecarpentier1,
Mottet2,
Dumas3
et al.
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)
Self Cite
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Adhesive Bonding of Passive Optical Components

Bosshard
1
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
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Agilent technologies' singlemode small form factor (SFF) module incorporates micromachined silicon, automated passive alignment, and non-hermetic packaging to enable the next generation of low-cost fiber optic transceivers

Owen
1
2000
IEEE Trans. Adv. Packag.
12
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