Agilent technologies' singlemode small form factor (SFF) module incorporates micromachined silicon, automated passive alignment, and non-hermetic packaging to enable the next generation of low-cost fiber optic transceivers

Owen, Man Hon Samuel

doi:10.1109/6040.846631

Cited by 12 publications

(2 citation statements)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Most of them make use of the mechanical and chemical properties of silicon using well known MEMS technologies like wet KOH etching and DRIE plasma etching to allow fiber being guided into grooves in front of active dies like photodiodes, laser diodes or waveguides. These works have been reported in many publications and books [1][2][3][4].…”

Section: Introductionmentioning

confidence: 87%

Dry-film technology as a standard process for passive optical alignment of Silicon Photonics Devices

Kopp

Bernabé

Philippe

2009

2009 59th Electronic Components and Technology Conference

View full text Add to dashboard Cite

Packaging of optolelectronic devices has always been a bottleneck for mass production. Today, it is still the case for Silicon Photonics Devices. Intrinsically, the technology of silicon nanowires integrated onto SOI electronic integrated circuits allows the same kind of cost reduction as the one encountered in the microelectronic industry. However, smart solutions have to be proposed in order not to lose this benefit because of the use of non suitable packaging architectures.In this paper, we present a low-cost, mass production compatible and easy-to-transfer technique that allows optical fibers to be passively aligned in front of silicon photonics devices' optical I/Os. This technique is based on the use of dry-film structures that enable optical fibers to be positioned with accuracy below 5 µm. Combined with optical input like photodiodes or with I/Os made of vertical grating coupler, this approach is a promising one for achieving future low cost integrated optical devices.Moreover, the concept could be extended to multichannel devices used for Parallel Optics links.

show abstract

Section: Introductionmentioning

confidence: 87%

Dry-film technology as a standard process for passive optical alignment of Silicon Photonics Devices

Kopp

Bernabé

Philippe

2009

2009 59th Electronic Components and Technology Conference

View full text Add to dashboard Cite

show abstract

“…These connections require high optical coupling efficiency and long-term stability for optical communications networks. Passive alignment is a cheap, fast, and simple aligning solution (Kosaka et al, 1996;Owen, 2000). In order to obtain the desired coupling efficiency, alignment tolerances of <100 nm are required.…”

Section: Introductionmentioning

confidence: 99%

Active Optical Fiber Alignment with a Piezoelectric Ultrasonic Motor Integrated Into Low Temperature Cofired Ceramics

Park

Baker

Eitel

et al. 2009

Journal of Intelligent Material Systems and Structures

View full text Add to dashboard Cite

The major goal of this research was to integrate an ultrasonic motor into a ceramic package for an active optical fiber alignment. Two degrees of freedom ultrasonic motor was successfully cofired with commercial low temperature cofired ceramic green tapes as well as with silver electrodes without encountering serious delamination, camber, and inter diffusion issues. High-power piezoelectric ceramics that can be sintered at 900 C was used for the ultrasonic motor. The motor successfully achieved fiber-to-laser optical alignment. Once alignment was achieved, a pre-stressed structure maintained the position of the fiber without any external electrical field or adhesive material. This package design provided a unique ability to adjust and realign an optical fiber.

show abstract

Single mode fiber MT-RJ SFF transceiver module using optical subassembly with a new shielded silicon optical bench

Iwase

Nomura

Izawa

et al. 2001

IEEE Trans. Adv. Packag.

View full text Add to dashboard Cite

Agilent technologies' singlemode small form factor (SFF) module incorporates micromachined silicon, automated passive alignment, and non-hermetic packaging to enable the next generation of low-cost fiber optic transceivers

Cited by 12 publications

References 2 publications

Dry-film technology as a standard process for passive optical alignment of Silicon Photonics Devices

Dry-film technology as a standard process for passive optical alignment of Silicon Photonics Devices

Active Optical Fiber Alignment with a Piezoelectric Ultrasonic Motor Integrated Into Low Temperature Cofired Ceramics

Single mode fiber MT-RJ SFF transceiver module using optical subassembly with a new shielded silicon optical bench

Contact Info

Product

Resources

About