Flexible device and component reliability study using simulations

Chen, Quayle; Xu, Leon; Jing, C.; Xue, Tom; Salo, Antti; Ojala, Kari

doi:10.1109/esime.2008.4525055

Cited by 6 publications

(2 citation statements)

References 4 publications

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“…Even the connection to fast moving parts with very high lifetime cycles, for example, read heads of optical drives, is achieved using flexible film connections. The investigation of the dynamic bending reliability of the components is indispensable [ 97 ].…”

Section: Bending Machinesmentioning

confidence: 99%

Bending Setups for Reliability Investigation of Flexible Electronics

et al. 2021

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Flexible electronics is a rapidly growing technology for a multitude of applications. Wearables and flexible displays are some application examples. Various technologies and processes are used to produce flexible electronics. An important aspect to be considered when developing these systems is their reliability, especially with regard to repeated bending. In this paper, the frequently used methods for investigating the bending reliability of flexible electronics are presented. This is done to provide an overview of the types of tests that can be performed to investigate the bending reliability. Furthermore, it is shown which devices are developed and optimized to gain more knowledge about the behavior of flexible systems under bending. Both static and dynamic bending test methods are presented.

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Section: Bending Machinesmentioning

confidence: 99%

Bending Setups for Reliability Investigation of Flexible Electronics

et al. 2021

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“…The package module with bending curvature of 1.25 inch passed the functionality test [8]. For UTCOF package, a number of studies about bending capacity, peeling strength, failure mode, reliability and electrical performance of interconnect have been presented [9] [10]. However, the relationship between electrical performances of devices and interconnections when a real die used in the package after various processes are still lack investigation critically.…”

Section: Introductionmentioning

confidence: 99%

The Contact Characteristics and NMOS performance of ACF-Bonded ultra-thin chip-on-flex (UTCOF) interconnects for bendable electronics

Lin

Kao

et al. 2010

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference

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In this study, our main goal is to evaluate the effects of residual stress between devices and interconnections after various processes and being applied a bending load on the electrical performances. Moreover, both the Contact Characteristics and metal-oxide-semiconductor field-effect transistor (NMOSFET) NMOS Performance of ACF-Bonded ultra-thin chip-on-olex (UTCOF) Interconnects under bending load are also investigated, a chip with n-type MOSFET was applied to UTCOF package. Firstly, gold stud bumping process was carried out on the NMOS wafer. Then, this wafer was thinning to about 50 μm in thickness. Finally, thin chip was flip-chip bonded onto PI substrate with ACF. Direct current (DC) characteristics of devices were measured after following processes: before bumping, after bumping, after DBG, after bonding, after bending and 85 °C / 85 % RH thermal humidity storage test (THST). The electrical performances of ACF joints were also monitored by measuring contact resistance. The effect of various processes could be quantified from the value of NMOS and contact resistance of ACF joints. Compared with UTCOF samples, a face-up ultra thin chip (UTC) was also laminated onto PET films. After package and lamination process, the THST test was performed under bending.The electrical performance of ACF joints and functionality of NMOS in the UTCOF interconnects have been measured before and after THST reliability test. Based on the results, process-induced residual stress effect is confirmed. The electrical characteristics and failure sequences between devices and joints in the UTCOF during bending and reliability test are understood.

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Generalized method for characterizing mechanical loads in mobile devices

Lumbantobing

Tiku

2012

2012 IEEE 62nd Electronic Components and Technology Conference

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This paper presents the concept and design of a test vehicle for characterizing applied mechanical loads on small form-factor devices. These loads can include forces, moments, and torques. A case-study utilizing a version of this test vehicle is discussed. The test vehicle weighs 100 grams and has a form factor similar to commonly available media players like Zune HD. Specific usage scenarios were selected to represent extreme loading conditions. The resulting multivariate, stochastic data were analyzed using the Bounded Johnson System distribution. This statistical treatment eases the use of the empirical data in subsequent analysis, such as determination of the appropriate in-lab loading conditions to quantify the mechanical robustness of a product. IntroductionRecent proliferation of mobile consumer electronic devices has led to a need for more efficient methods to better predict the reliability of these devices in various use scenarios.[1] These scenarios range from transporting these devices in pockets, back-packs, and purses; to leaving them in parked vehicles or other non-climate-controlled spaces. Some of these use cases were not seen by consumer products in the past.Miniaturization, growing device complexity, and reduction in development time due to time-to-market pressures exacerbate this need.The first step in predicting reliability is to accurately characterize the expected mechanical and other stress profiles for the product during its use life. The ability to quickly and accurately quantify the design margins for a product based on this knowledge minimizes the risk of costly product returns and the bill-of-material costs due to unnecessary over-design. This also allows the opportunity for concurrent evaluation of multiple device architectures while evaluating trade-off scenarios for reliability, manufacturability, industrial design, etc. This consequently can reduce the number of unnecessary design compromises to be made during development.To evaluate reliability at both component and board levels, mechanical stresses are an essential input. [2-4] These stresses may be obtained from crude estimations, historical data from similar products, or evaluating the actual component or board placed inside a product prototype. The issue with the first two approaches is the accuracy of the estimates; and the third approach constraints the estimates around a specific design and requires a higher level of design maturity. This paper presents a generalized methodology for characterizing mechanical loads that a handheld device may experience while in use. It can be used very early in the development phase to support high quality decisions on competing design options.

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Flexible device and component reliability study using simulations

Cited by 6 publications

References 4 publications

Bending Setups for Reliability Investigation of Flexible Electronics

Bending Setups for Reliability Investigation of Flexible Electronics

The Contact Characteristics and NMOS performance of ACF-Bonded ultra-thin chip-on-flex (UTCOF) interconnects for bendable electronics

Generalized method for characterizing mechanical loads in mobile devices

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