Flexible and Robust Functionalized Boron Nitride/Poly(p-Phenylene Benzobisoxazole) Nanocomposite Paper with High Thermal Conductivity and Outstanding Electrical Insulation

Abstract

With the rapid development of 5G information technology, thermal conductivity/dissipation problems of highly integrated electronic devices and electrical equipment are becoming prominent. In this work, “high-temperature solid-phase & diazonium salt decomposition” method is carried out to prepare benzidine-functionalized boron nitride (m-BN). Subsequently, m-BN/poly(p-phenylene benzobisoxazole) nanofiber (PNF) nanocomposite paper with nacre-mimetic layered structures is prepared via sol–gel film transformation approach. The obtained m-BN/PNF nanocomposite paper with 50 wt% m-BN presents excellent thermal conductivity, incredible electrical insulation, outstanding mechanical properties and thermal stability, due to the construction of extensive hydrogen bonds and π–π interactions between m-BN and PNF, and stable nacre-mimetic layered structures. Its λ∥ and λ⊥ are 9.68 and 0.84 W m−1 K−1, and the volume resistivity and breakdown strength are as high as 2.3 × 1015 Ω cm and 324.2 kV mm−1, respectively. Besides, it also presents extremely high tensile strength of 193.6 MPa and thermal decomposition temperature of 640 °C, showing a broad application prospect in high-end thermal management fields such as electronic devices and electrical equipment.

Highly and Uniformly Thermal Conductive Phase Change Composites by Constructing the Bidirectionally Oriented and Interconnected Boron Nitride Nanosheet Network

“…This is due to the close packing of numerous BNNSs. Although considerable efforts have been dedicated to designing thermal conductive composites, most of them realized the improvement of TC along with one direction, causing a compromised TC in the perpendicular direction. , In contrast, our OBP offers a feasible solution for implementing a rapid and uniform heat transfer. It is bound up with the construction of effective phonon transportation pathways by the radially and vertically oriented overlapped BNNSs.…”

Adhesion Energy-Assisted Low Contact Thermal Resistance Epoxy Resin-Based Composite

“…Epoxy resins have been widely used in electrical packaging, circuit boards, etc., due to their excellent mechanical properties and good processability. − However, with the development of electronic components toward integration, miniaturization, and intelligence, − their increasing heat dissipation requirements pose a big challenge to epoxy resins, which possess low thermal conductivity in the range from 0.1 to 0.5 W/(m·K). The addition of thermal conductive fillers, such as hexagonal boron nitride (h-BN), , boron nitride nanotube, Al 2 O 3 , and carbon materials (carbon nanotube, graphene), has been widely utilized to enhance the thermal conductivity of epoxy resins.…”

Highly Thermally Conductive Flexible Biomimetic APTES-BNNS/BC Nanocomposite Paper by Sol–Gel-Film Technology

“…Owing to the synergistic effect of BN and T-ZnO, the in-plane thermal conductivity of the composite was as high as 1.96 W/(m·K). Tang et al prepared m-BN/poly­( p -phenylene benzobisoxazole) nanofiber (PNF) nanocomposite paper with nacre-mimetic-layered structures via sol–gel-film transformation approach. The obtained m-BN/PNF nanocomposite paper with 50 wt % m-BN presents excellent thermal conductivity ( K // and K ⊥ are 9.68 and 0.84 W/(m·K)) and incredible electrical insulation (2.3 × 10 15 Ω·cm).…”