Abstract:Charge trapping over the channel can occur from program/erase cycling of Flash memory cells, increasing the cell threshold voltage and causing threshold shifts in retention tests when charges detrap. The empirical characteristics of these effects are discussed. Trapping has a square-root dependence on program/erase cycle count. Detrapping scales with the logarithm of time and is thermally accelerated with an activation energy of 1.1 to 1.2 eV. Detrapping has only a weak dependence on electric field. These mech… Show more
“…Charge trapping is also inserted in a phenomenological manner, in agreement with the observed square-root dependence on N C [221,222], resulting in the following expression for the average number of electrons being trapped at cycle N C :…”
Section: Modelsmentioning
confidence: 68%
“…Figure 21 shows instead the dependence on the bake conditions: note that the detrapping dynamics depend on the time t 0 elapsing between the last program and the first read operation (left-hand side), resulting in a shift of the detrapping curve along the log-time axis by a quantity exactly equal to t 0 . Also, ∆V T depends upon the bake temperature T B (right-hand side of Figure 21), demonstrating that detrapping is thermally activated: the ∆V T curves at different T B are shifted according to an Arrhenius law with activation energy E A ≈ 1.1 eV [221,222,228,229], a single detrapping curve can be obtained for an equivalent T B . This value of activation energy had been also observed in earlier retention experiments [51].…”
Section: Charge Detrappingmentioning
confidence: 94%
“…Moreover, as charge is trapped into the oxide during P/E cycling and detrapped in-between, a dependence on the cycling pattern arises, which complicates the development of comprehensive models. Such task began in [221,222] and developed into a full model accounting for the major experimental evidence in [223][224][225]. Figure 19 shows experimental data from a retention experiment at room temperature on a 16 nm NAND vehicle after 10 4 P/E cycles [226].…”
Section: Charge Detrappingmentioning
confidence: 99%
“…We start this Section with the description of a compact model [221,222,226] that captures the main features of the data and can be used for some first-order extrapolations, while moving to more refined descriptions of the underlying physics later on. To this aim, we assume a log-time dependence of the V T shift that, considering that the first read operation is performed at time t 0 after the end of the cycling phase, leads to…”
Section: Modelsmentioning
confidence: 99%
“…The experimental data presented so far and the physical understanding leading to Equation (11) led to the recognition that traditional testing procedures based on fast cycling and long retention times were magnifying the V T loss with respect to real usage conditions, when cycling takes place over the functional life of the device (see the effect of increasing t C in Figure 22, left). The concept of distributed cycling conditions was then proposed in [221] as a way to better emulate the real array behavior by performing either a uniform cycling over a longer time or several groups of fast cycles preceded by bake times, usually at high temperature to accelerate the charge loss. However, the previous model shows its limitations when dealing with highly non-uniform cycling patterns, calling for a more comprehensive interpretation of the trapping/detrapping physics, that was pursued in [223][224][225]227,233].…”
Abstract:We review the state-of-the-art in the understanding of planar NAND Flash memory reliability and discuss how the recent move to three-dimensional (3D) devices has affected this field. Particular emphasis is placed on mechanisms developing along the lifetime of the memory array, as opposed to time-zero or technological issues, and the viewpoint is focused on the understanding of the root causes. The impressive amount of published work demonstrates that Flash reliability is a complex yet well-understood field, where nonetheless tighter and tighter constraints are set by device scaling. Three-dimensional NAND have offset the traditional scaling scenario, leading to an improvement in performance and reliability while raising new issues to be dealt with, determined by the newer and more complex cell and array architectures as well as operation modes. A thorough understanding of the complex phenomena involved in the operation and reliability of NAND cells remains vital for the development of future technology nodes.
“…Charge trapping is also inserted in a phenomenological manner, in agreement with the observed square-root dependence on N C [221,222], resulting in the following expression for the average number of electrons being trapped at cycle N C :…”
Section: Modelsmentioning
confidence: 68%
“…Figure 21 shows instead the dependence on the bake conditions: note that the detrapping dynamics depend on the time t 0 elapsing between the last program and the first read operation (left-hand side), resulting in a shift of the detrapping curve along the log-time axis by a quantity exactly equal to t 0 . Also, ∆V T depends upon the bake temperature T B (right-hand side of Figure 21), demonstrating that detrapping is thermally activated: the ∆V T curves at different T B are shifted according to an Arrhenius law with activation energy E A ≈ 1.1 eV [221,222,228,229], a single detrapping curve can be obtained for an equivalent T B . This value of activation energy had been also observed in earlier retention experiments [51].…”
Section: Charge Detrappingmentioning
confidence: 94%
“…Moreover, as charge is trapped into the oxide during P/E cycling and detrapped in-between, a dependence on the cycling pattern arises, which complicates the development of comprehensive models. Such task began in [221,222] and developed into a full model accounting for the major experimental evidence in [223][224][225]. Figure 19 shows experimental data from a retention experiment at room temperature on a 16 nm NAND vehicle after 10 4 P/E cycles [226].…”
Section: Charge Detrappingmentioning
confidence: 99%
“…We start this Section with the description of a compact model [221,222,226] that captures the main features of the data and can be used for some first-order extrapolations, while moving to more refined descriptions of the underlying physics later on. To this aim, we assume a log-time dependence of the V T shift that, considering that the first read operation is performed at time t 0 after the end of the cycling phase, leads to…”
Section: Modelsmentioning
confidence: 99%
“…The experimental data presented so far and the physical understanding leading to Equation (11) led to the recognition that traditional testing procedures based on fast cycling and long retention times were magnifying the V T loss with respect to real usage conditions, when cycling takes place over the functional life of the device (see the effect of increasing t C in Figure 22, left). The concept of distributed cycling conditions was then proposed in [221] as a way to better emulate the real array behavior by performing either a uniform cycling over a longer time or several groups of fast cycles preceded by bake times, usually at high temperature to accelerate the charge loss. However, the previous model shows its limitations when dealing with highly non-uniform cycling patterns, calling for a more comprehensive interpretation of the trapping/detrapping physics, that was pursued in [223][224][225]227,233].…”
Abstract:We review the state-of-the-art in the understanding of planar NAND Flash memory reliability and discuss how the recent move to three-dimensional (3D) devices has affected this field. Particular emphasis is placed on mechanisms developing along the lifetime of the memory array, as opposed to time-zero or technological issues, and the viewpoint is focused on the understanding of the root causes. The impressive amount of published work demonstrates that Flash reliability is a complex yet well-understood field, where nonetheless tighter and tighter constraints are set by device scaling. Three-dimensional NAND have offset the traditional scaling scenario, leading to an improvement in performance and reliability while raising new issues to be dealt with, determined by the newer and more complex cell and array architectures as well as operation modes. A thorough understanding of the complex phenomena involved in the operation and reliability of NAND cells remains vital for the development of future technology nodes.
Resistive‐switching random‐access memory (RRAM) based on ion migration in insulating layers might revolutionize future nanoelectronic circuits for both memory and logic. The high‐speed, low‐power change of resistance in RRAM can be exploited not only for data storage but also for reconfiguration of programmable logic circuits and for neuromorphic computation. In this review, the strengths and limitations of RRAM will be discussed. First, the RRAM concept will be reviewed in terms of memory operation and physical mechanisms for switching. The RRAM architectures will be discussed with emphasis on the crossbar array structure allowing for high density and reliable operation through proper selector devices. Finally, the RRAM applications in computing systems will be reviewed, addressing the RRAM switch in field‐programmable gate array (FPGA) and neuromorphic circuits.
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