Flame-Retardant Cycloaliphatic Epoxy Systems with High Dielectric Performance for Electronic Packaging Materials

Abstract

Flame–retardant cycloaliphatic epoxy systems have long been studied; however, the research suffers from slow and unsatisfactory advances. In this work, we synthesized a kind of phosphorus-containing difunctional cycloaliphatic epoxide (called BCEP). Then, triglycidyl isocyanurate (TGIC) was mixed with BCEP to achieve epoxy systems that are rich in phosphorus and nitrogen elements, which were cured with 4–methylhexahydrobenzene anhydride (MeHHPA) to obtain a series of flame–retardant epoxy resins. Curing behaviors, flame retardancy, thermal behaviors, dielectric performance, and the chemical degradation behaviors of the cured epoxy system were investigated. BCEP–TGIC systems showed a high curing activity, and they can be efficiently cured, in which the incorporation of TGIC decreased the curing activity of the resin. As the ratio of BCEP and TGIC was 1:3, the cured resin (BCEP1–TGIC3) showed a relatively good flame retardancy with a limiting oxygen index value of 25.2%. In the cone calorimeter test, they presented a longer time to ignition and a lower heat release than the commercially available cycloaliphatic epoxy resins (ERL–4221). BCEP–TGIC systems presented good thermal stability, as the addition of TGIC delayed the thermal weight loss of the resin. BCEP1–TGIC3 had high dielectric performance and outperformed ERL–4221 over a frequency range of 1 HZ to 1 MHz. BCEP1–TGIC3 could achieve degradation under mild conditions in an alkali methanol/water solution. Benefiting from the advances, BCEP–TGIC systems have potential applications as electronic packaging materials in electrical and electronic fields.

A mini‐review of ultra‐low dielectric constant intrinsic epoxy resins: Mechanism, preparation and application

“…However, the common epoxy resins are a typical kind of flammable material that is prone to fire and explosion incident during production, when the weapon is damaged and the smart home equipment occurs to short circuit. 60 According to the different flame-retardant elements, flameretardant epoxy resins can be divided into the halogen, phosphorus, nitrogen, and silicon systems. Introduction of halogen atoms, such as the fluorine, chlorine, and bromine, into the curing network of epoxy resins to prepare flame-retardant epoxy resins is one of the earliest adopted modification methods.…”

“…With the gradual increase in the degree of information technology of military weapons and the rapid popularization of the concept of smart home, the proportion of electronic equipment in weapons and home decoration is significantly increasing. However, the common epoxy resins are a typical kind of flammable material that is prone to fire and explosion incident during production, when the weapon is damaged and the smart home equipment occurs to short circuit 60 …”

Curing Behavior and Properties of Active Ester Cured Cycloaliphatic Epoxy Resins

“…Conversely, cycloaliphatic epoxy resins, synthesized through peroxide-mediated oxidation of double bonds, exhibit no chlorine residue . Moreover, these cycloaliphatic resins demonstrate excellent processability, with cured resins exhibiting high glass transition temperatures, superior resistance to UV radiation, and impressive mechanical and dielectric properties. − Consequently, cured cycloaliphatic epoxy resins find extensive utilization in electronic packaging materials, optical devices, and related applications. − …”

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High Tg, Low CTE, and Intrinsic Flame Retardancy

“…7,8 Furthermore, according to legal regulations, electronic products must take fire prevention measures. 9 To achieve the flame retardancy of EMC, conventional methods involve using brominated epoxy resin or adding flame retardants such as antimony oxide, metal hydroxide, and phosphorus compounds. 10 However, the halogen-containing resins and antimony oxide-based flame retardants, are harmful to both the environment and human health.…”

“…Furthermore, according to legal regulations, electronic products must take fire prevention measures . To achieve the flame retardancy of EMC, conventional methods involve using brominated epoxy resin or adding flame retardants such as antimony oxide, metal hydroxide, and phosphorus compounds .…”