International Conference on Space Optics — ICSO 2012 2017
DOI: 10.1117/12.2309230
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First measurements of true charge transfer TDI (Time Delay Integration) using a standard CMOS technology

Abstract: Abstract-This work focus on an innovative noiseless charge transfer TDI pixel fabricated with a one poly standard Imaging CMOS technology. Parallel column charge to voltage conversion decreases drastically the number of needed charge transfers while keeping high motion/dynamic MTF (multi phase approach), high QE (photodiode based architecture) and low noise (no noise summation).

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Cited by 3 publications
(2 citation statements)
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“…Two variants, referred to as CCDlike and the Hammer Shape Pixel (HSP), each with pixel pitches of 7 µm or 13 µm, were studied. The Hammer Shape Pixel design and characterisation is described in [1]. This work looks at characterisation of the 13 µm CCD-like pixel device.…”
Section: Test Chipmentioning
confidence: 99%
“…Two variants, referred to as CCDlike and the Hammer Shape Pixel (HSP), each with pixel pitches of 7 µm or 13 µm, were studied. The Hammer Shape Pixel design and characterisation is described in [1]. This work looks at characterisation of the 13 µm CCD-like pixel device.…”
Section: Test Chipmentioning
confidence: 99%
“…The camera system readout noise is 6e − . CMOS (Complementary Metal Oxide Semiconductor image sensors) [3][4][5] sensors use the CMOS process, which is most commonly used in general semiconductor circuits. Thereby, the convenience of integrating peripheral circuits (such as ADC [6], CDS, Timing generator or DSP) [7] into the sensor chip can save the cost of peripheral chips.…”
Section: Introductionmentioning
confidence: 99%