First demonstration of drop-test reliability of ultra-thin glass BGA packages directly assembled on boards for smartphone applications

Singh, Bhupender; Smet, Vanessa; Lee, Jaesik; Menezes, Gary; Kobayashi, Makoto; Raj, P. Markondeya; Roggeman, Brian; Ray, Urmi; Radojcic, Riko; Tummala, Rao

doi:10.1109/ectc.2015.7159806

Cited by 14 publications

(5 citation statements)

References 8 publications

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“…When comparing to the elongation of PS-Ph, which possesses an elongation of 30%, the difference is evident. Furthermore, the test vehicles with LT-PI have undergone accelerated stress tests [3] without any trace of physical degradations such as cracks nor copper RDL breakage, which reassured our assumption of elongation being an essential mechanical property to improve the reliability.…”

Section: A Design Concept Of Lt-pimentioning

confidence: 63%

“…Dielectric materials for copper RDLs of heterogeneous integration packages require good mechanical properties as well as low temperature curable in nature to fabricate reliable packages. In order to withstand various reliability tests, LT-PI must obtain excellent mechanical properties, especially, elongation (>40%), which we believe to be the key factor [3]. For this reason, we have introduced flexible molecular units in LT-PI with an assumption to increase the entanglement of each polymer chain.…”

Section: A Design Concept Of Lt-pimentioning

confidence: 99%

“…In addition to the findings during the accelerated stress tests [3] for LT-PI, a low-stress type of PSPI with more flexible units than LT-PI has been developed unintentionally. The finding of this low-stress PI was a bonus during our development.…”

Section: A Design Concept Of Lt-pimentioning

confidence: 99%

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Next Level of 1/1 μm Line and Space Copper Redistribution Layer Fabrication with Organic Dielectric Materials

Shoji,

Nishimura,

Ogasawara

et al. 2024

IMAPSource Proceedings

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An electrical reliability of fine copper redistribution layer (RDL) with 1/1 μm line and space fabricated by using positive photosensitive polyimide (PSPI) has been demonstrated. The polyimide containing flexible molecular units in PSPI was introduced, in assumption to increase the entanglement of each polymer chain with a design concept of polymer backbone to enhance mechanical and thermal reliability. To conduct a series of tests, test vehicles with semi-additive copper RDL with 1/1 μm line and space were fabricated with Toray’s PSPI for electrical reliability test. Through a series of electrical reliability tests utilizing our test vehicles, PSPI out-performed the phenol-based resin, which has been proven to have excellent mechanical and thermal stabilities when compared with other resins. 1/1 μm line and space electrodes after electrical reliability tests were also observed and cross-sectioned. The observation of electrodes clearly showed oxidation-reduction of the electrodes on anode and cathode, respectively. On the cathode, copper particles of several nm in diameter were formed on the PI film surrounding the copper wiring. On the anode, copper oxide layers of about 100 nm thickness were observed on the copper wiring surface, which turned out to be Cu2O when analyzed with Electron Energy-Loss Spectroscopy (EELS) measurement.

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Section: A Design Concept Of Lt-pimentioning

confidence: 63%

Section: A Design Concept Of Lt-pimentioning

confidence: 99%

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Next Level of 1/1 μm Line and Space Copper Redistribution Layer Fabrication with Organic Dielectric Materials

Shoji,

Nishimura,

Ogasawara

et al. 2024

IMAPSource Proceedings

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“…Singh et al [40] studied the drop reliability of SAC105 BGA packages with partial underfill dispensing under thermal cycling (-40 to 125°C) and drop (1500 G) loadings. For the drop test, the first failure cycle in corner nets of the underfill samples was twice that of non-underfill samples.…”

Section: Concerns Associated With Pb-free Electronicsmentioning

confidence: 99%

Assembly Options and Challenges for Electronic Products With Lead-Free Exemption

et al. 2020

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Due to safety and reliability concerns, various classes and/or applications of electronic products are excluded from the European Union's Restriction of Hazardous Substances (RoHS) regulations requiring the elimination of lead (Pb). However, the majority of electronic devices are now Pb-free. As a result, manufacturers attempting to maintain tin-lead (SnPb) based electronics face an increasing challenge to procure parts and products with Pb-based solder. This paper reviews the challenges of producing Pbbased electronic equipment, the reliability concerns with Pb-free electronics, and the options that manufacturers have for maintaining reliable, Pb-based production. In particular, the paper examines mixed soldering processes and the re-balling of Pb-free electronic parts. While Pb-free electronics present risks, it is our conclusion that the risks are manageable and are lower than those incurred by maintaining an increasingly obsolete Pb-based manufacturing process.

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“…Recently, dielectric materials for re-distribution layers (RDLs) have been focused on for the multi-pinned devices such as Fan-out Wafer Level Packages (FOWLPs), which is the one of the latest packaging trends in microelectronics [1][2][3]. There are a few requirements for dielectric materials as follows: the low-temperature curable nature (<250 °C) because the devices are embedded by the molded compound with low heat resistance, the strong adhesion to the copper RDLs, high chemical resistance, and high reliability in the multi-layered dielectric materials after the reliability test, for instance thermal humidity test, thermal cycle, and high-impact test, and so on [4].…”

Section: Introductionmentioning

confidence: 99%

Development of Novel Low-temperature Curable Positive-Tone Photosensitive Polyimide with High Elongation

Shoji

Koyama

Masuda

et al. 2016

J. Photopol. Sci. Technol.

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Recently, progress of semiconductor packaging is drastic and multi-pinned devices such as Fan-out Wafer Level Packages (FOWLPs) attract much attention. For those applications, photosensitive polyimides (PSPIs) are applied as redistribution layers (RDLs) and they are required to have high level of properties such as adhesion to metal and reliability. We developed novel low-temperature curable positive-tone photosensitive polyimides (posi-PSPIs) with high elongation, strong adhesion to the copper RDLs, and high chemical resistance for establishing the multi RDLs by improving the base-polyimides and incorporating polyimides with cross-linkers and adhesion promoters.

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First demonstration of drop-test reliability of ultra-thin glass BGA packages directly assembled on boards for smartphone applications

Cited by 14 publications

References 8 publications

Next Level of 1/1 μm Line and Space Copper Redistribution Layer Fabrication with Organic Dielectric Materials

Next Level of 1/1 μm Line and Space Copper Redistribution Layer Fabrication with Organic Dielectric Materials

Assembly Options and Challenges for Electronic Products With Lead-Free Exemption

Development of Novel Low-temperature Curable Positive-Tone Photosensitive Polyimide with High Elongation

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