Abstract:We modeled flexible microelectronic systems and analyzed the stress and strain distribution assuming an international standard bending test evaluating flexible electronics. The flexible microelectronic system consisted of a flexible substrate, a thin silicon die bonded to the substrate using bumps, and an underfill and molding layer. The highest stress values were found at the square silicon die corners under bending deformation. After rounding the die corners, the copper bumps were the weakest component in th… Show more
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.