Finite-Difference Modeling of Noise Coupling between Power/Ground Planes in Multilayered Packages and Boards

Abstract

Multilayered packages and boards, such as high performance server boards, contain thousands of signal lines, which have to be routed on and through several layers with power/ground planes in between. There can be noise coupling not only in the transversal direction through the power/ground planes in such a structure, but also vertically from one plane pair to another through the apertures and via holes. In addition, the continuous increase in power demand along with reduced Vdd values results in significant current requirement for the future chips. Hence, the parasitic effects of the power distribution system become increasingly more critical regarding the signal integrity and electromagnetic interference properties of cost-effective high-performance designs. We present a multilayer finite-difference method (M-FDM), which is capable of characterizing such noise coupling mechanisms. This method allows to consider realistic structures, which would be prohibitive to simulate using fullwave simulators.

Efficient Modeling of Package Power Delivery Networks with Fringing Fields and Gap Coupling in Mixed Signal Systems

“…The finite difference frequency domain method (FDFD) has been used as a simple and efficient method for modeling single-plane pair structures. This formulation is similar to the method presented in [2] and has been developed in [3]. A plane pair can be discretized into square "unit cells" as shown in Figure la Package structures typically contain split planes and power islands.…”

Efficient power‐bus modeling based on an adaptive frequency sampling technique

“…Finally, the proposed technique is fully compatible with existing numerical techniques to accelerate the computation of the cavity model, meaning that all frequency samples can be computed using the methods presented in [21,22], or using 3D methods such as the PEEC method [11] and the finite-difference algorithm [13,14].…”

“…Full-wave equivalent circuit models have been proposed in order to allow the fringing fields to be taken into account [12][13][14]. Despite their accuracy, all these techniques are usually time and memory consuming and their use may be unpractical even for simple geometries.…”

Principle and applications of segmented modeling method of via

“…FEM, FDTD, TML are used for full-wave simulation method to complete the modeling of via and study the characteristics of via. Although some full-wave analytical methods are fairly accurate, they need longer time and are not favorable to optimize the design, for example, the Finite Difference Time Domain method [1][2]. Some methods are simple and fast, but they are not precise enough for the analysis of complex high-frequency circuits, e.g., the semi-quasi-static method and physics-based method [3][4].…”

“…Z pp represents the impedance of the power/ground plane pair which can be calculated by analytical formulas follows [7]. 2 As shown in Fig. 1, via is decomposed into three parts in the process of segmented modeling: 1) the vertical conversion structure of the top-level transmission line to via; 2) the vertical via structure of the middle multilayer; 3) the vertical conversion structure of via to the bottom transmission line.…”