Abstract:We have studied a thermo-compression bonding method for high density interconnections. Fluxes are commonly used in conventional solder bonding. However, flux applications have several issues such as the void generation in solder and the flux residue remaining between bumps. These could degrade their reliabilities seriously when the bump pitch becomes small since these features do not scale to bump-pitch dimensions. In this paper, we present the experimental results on the investigation of flux-less bonding wit… Show more
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