Fine grinding of silicon wafers: effects of chuck shape on grinding marks

A grinding-based manufacturing method for silicon wafers: generation mechanisms of central dimples on ground wafers

“…Due to limitations of currently available measurement tools [12], the exact chuck shapes were not known. However, based on the mathematical model for the chuck shape [12][13][14], it is possible to know approximately the chuck shape once the setup parameters are determined.…”

A Grinding-Based Manufacturing Method for Silicon Wafers: Generation Mechanisms of Central Bumps on Ground Wafers

“…A major reason to adjust the spindle angles is that the chuck material is different from silicon and, therefore, the grinding force when grinding the chuck is different from that when grinding the wafers. Further discussion on spindle angle adjustments can be found in other papers (18,19). r chuck , h chuck : radius and depth of the dimple on the chuck (formed when the chuck is ground).…”

Research on topography control of two-spindle and three-workstation wafer grinder

“…Some researchers [10][11][12] have mentioned that the chuck surface should not be planar, but did not report the detail effects of chuck shape on the wafer flatness and the method to obtain a designed wafer shape. For theoretical research, Suna et al [13] provided a practical guidance to industry in choosing the appropriate chuck shape to minimize grinding marks. Chidambaram et al [14] developed a mathematical model to predict the grinding marks.…”