ASME/JSME 2011 8th Thermal Engineering Joint Conference 2011
DOI: 10.1115/ajtec2011-44161
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Film-Cooling Performance of Anti-Vortex Hole on a Flat Plate

Abstract: Film cooling performance of two hole geometries is evaluated on a flat plate surface with steady-state IR (infrared thermography) technique. The base geometry is a simple cylindrical hole design inclined at 30° from the surface with pitch-to-diameter ratio of 3.0. The second geometry is an anti-vortex design where the two side holes, also of the same diameter, branch out from the root at 15° angle. The pitch-to-diameter ratio is 6.0 between the main holes. The mainstream Reynolds number is 3110 based on the co… Show more

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“…When the anti vortex holes are nearer to the primary film cooling holes and are developing from the base of the primary holes, better film cooling was accomplished as compared to other anti vortex hole orientations. Narzary et al (2011) presented a new anti-vortex design geometry where the two side holes, also of the same diameter, branch out from the root at 15 o angle based on Dhungel et al (2009). The pitch-to-diameter ratio was increased to 6.0 between the main holes.…”
Section: -2014mentioning
confidence: 99%
“…When the anti vortex holes are nearer to the primary film cooling holes and are developing from the base of the primary holes, better film cooling was accomplished as compared to other anti vortex hole orientations. Narzary et al (2011) presented a new anti-vortex design geometry where the two side holes, also of the same diameter, branch out from the root at 15 o angle based on Dhungel et al (2009). The pitch-to-diameter ratio was increased to 6.0 between the main holes.…”
Section: -2014mentioning
confidence: 99%