2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers 2013
DOI: 10.1109/isscc.2013.6487708
|View full text |Cite
|
Sign up to set email alerts
|

Filament scaling forming technique and level-verify-write scheme with endurance over 107 cycles in ReRAM

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
21
0

Year Published

2013
2013
2022
2022

Publication Types

Select...
5
2
2

Relationship

0
9

Authors

Journals

citations
Cited by 35 publications
(21 citation statements)
references
References 5 publications
0
21
0
Order By: Relevance
“…However, the precondition of the approximation may be difficult to be satisfied and may decrease computation accuracy. For example, R ON ≈ 1kΩ for a physical RRAM device [11], [18] and N l=1 c k,l ≈ 5 for a 256 × 256 RRAM crossbar array [7]. And according to Eq.…”
Section: The Third Stage: Map Matrix Parameters To Rram Device Conmentioning
confidence: 99%
“…However, the precondition of the approximation may be difficult to be satisfied and may decrease computation accuracy. For example, R ON ≈ 1kΩ for a physical RRAM device [11], [18] and N l=1 c k,l ≈ 5 for a 256 × 256 RRAM crossbar array [7]. And according to Eq.…”
Section: The Third Stage: Map Matrix Parameters To Rram Device Conmentioning
confidence: 99%
“…Similarly, ReRAM has the reliability issues of the resistive switching. Previous work [6] implemented the recovery algorithm into write operations due to the measure of abnormal bit behavior. Thus reliability issues for emerging memories are still remained and might hamper the switching current reduction and the memory cell shrinkage.…”
Section: Toward the Emerging Memoriesmentioning
confidence: 99%
“…Among all others Back-Endof-Line (BEoL) resistive memory candidates (e.g. Phase Change or Magnetic Memory -PCM, MRAM), Oxide-based and Conductive bridge-based RRAM (OxRAM, CBRAM) are the most promising since their Metal-Insulator-Metal (MIM) structure is composed of materials already available in foundries, thereby driving down the process costs [2] [3]. However, while bipolar behavior (featured by most of the 2terminals OxRAM, CBRAM or MRAM technologies) enables better endurance and lower energy consumption [4] than unipolar device, new constraints appear if co-integrated with unipolar selectors such as Metal Oxide Semiconductor (MOS) transistors.…”
Section: Introductionmentioning
confidence: 99%