2010
DOI: 10.1016/j.microrel.2010.01.016
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Field enhancement of omega-shaped-gated poly-Si TFT SONOS memory fabricated by a simple sidewall spacer formation

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Cited by 6 publications
(5 citation statements)
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“…1 [8]- [10]. A 1.0-μm-thick thermal SiO 2 was first grown on a single-crystal silicon wafer as starting substrate.…”
Section: Device Fabricationmentioning
confidence: 99%
“…1 [8]- [10]. A 1.0-μm-thick thermal SiO 2 was first grown on a single-crystal silicon wafer as starting substrate.…”
Section: Device Fabricationmentioning
confidence: 99%
“…As a probable effort to improve bit density of NAND flash memory while suppressing the performance degradation, NAND string structures using fringing field from control gates (CGs) are proposed. [1][2][3][4][6][7][8][9] A single MOSFET using fringing field from the gate was studied by other research group. 5) As a method to enlarge the usage of the fringing field from the gate, the NAND string with underlapped source/drain (S/D) or no S/D between gates was proposed in ref.…”
Section: Introductionmentioning
confidence: 99%
“…3) Excellent characteristics of a NAND string which has cells with virtual S/D and increased L g at a fixed pitch were reported. 4) Although the NAND string structures to maximize the usage of fringing field from the control gates were reported [6][7][8] and theoretically studied, 9) NAND string characteristics with body doping modulation has not been reported yet. By changing the counter-doping concentration of n-type dopants in a space region between gates for a given p-type doping concentration, we can modulate net doping concentration in the space region, which means that the p-type doping between cells can be less than that in the channel or the n-type counter doping region is fully depleted or neutral when a pass bias (V pass ) is 0 V. Due to the counter doping, the virtual source/drain regions can be formed easily at the space, resulting in electrically connection of cell transistors in a string.…”
Section: Introductionmentioning
confidence: 99%
“…1. The details of process flow could be found in our previous report [1]. After the a-Si film was transferred into poly-Si by solid phase crystallization at 600 °C for 24 hours in N 2 ambient, the diluted hydro-fluoric acid (DHF) solution was used to etch the SiO 2 strip for 100-nm-thick to fabricate the poly-Si NWs.…”
mentioning
confidence: 99%