“…This is also in stark contrast to conventional epitaxy based on covalent bonds, where the covalent bonds cause strained layers for very thin films, which results in a partial relaxation with a concurrent formation of dislocations. Hence, the vdW epitaxy of TI films can be realized on a large variety of substrates, and the MBE growth of fully relaxed TI films has been successfully accomplished on SrTiO 3 , [ 27 ] SiC, [ 12 ] CdS, [ 28 ] CdTe, [ 29,30 ] Al 2 O 3 , [ 31 ] GaAs, [ 32,33 ] GaN, [ 34 ] graphene, [ 12 ] InP, [ 35–37 ] and Si. [ 4,22,38,39,40,41 ] However, most of these substrates have a hexagonal arrangement of the surface atoms, i.e., the (111) orientation for cubic substrates and (0001) orientation for hexagonal substrates, to match the hexagonal crystal structure of the TI material, which is mandatory to warrant single‐crystal growth, as will be discussed in the next paragraph.…”