1987
DOI: 10.1557/proc-104-483
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Fermi Level Stabilization in Semiconductors: Implications for Implant Activation Efficiency

Abstract: We propose the existence of a Fermi level stabilization energy in III-V semiconductors which provides a reference level for the electronic part of defect annihilation energies. It is shown that the position of the stabilization energy with respect to the band edges determines the maximum free carrier concentration which can be obtained through doping. The proposed model accounts for previously unexplained trends in implant activation efficiency in III-V semiconductors.

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Cited by 11 publications
(1 citation statement)
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“…Electron accumulation has previously been reported in InSb grain boundaries [29,30] as well as in an InSb/or-Sn interface [31]. It has also been suggested that the Fermi level should pin in the bandgap [32] contrary to our result. It is possible that the pinning energy depends on the treatment of the surface during and after growth [33], e.g.…”
Section: Temperature Dependence Of Carrier Concentrationcontrasting
confidence: 86%
“…Electron accumulation has previously been reported in InSb grain boundaries [29,30] as well as in an InSb/or-Sn interface [31]. It has also been suggested that the Fermi level should pin in the bandgap [32] contrary to our result. It is possible that the pinning energy depends on the treatment of the surface during and after growth [33], e.g.…”
Section: Temperature Dependence Of Carrier Concentrationcontrasting
confidence: 86%