Femtosecond laser micromachining of grooves in silicon with 800 nm pulses

Crawford, T.H.R.; Borowiec, A.; Haugen, H.K.

doi:10.1007/s00339-004-2941-2

Cited by 107 publications

(69 citation statements)

References 30 publications

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“…The microchannel width W M and microchannel depth H M of both polyamides increase gradually with increasing laser power, and thus the width of un-fabricated surface (no laser irradiation area) decreases. These results are the same tendencies as the microchannels on the 040002-2 silicone by Crawford et al 12) and the PTFE by Naruse et al 8) . The size of microchannels is closely related to the energy density, which is the multiplication of laser power and laser speed.…”

Section: Resultssupporting

confidence: 78%

Fabrication of micro-structured surface of plants-derived polyamide using femtosecond laser and their frictional properties

Nakamura¹,

Naruse²,

Nishitani³

et al. 2016

AIP Conference Proceedings

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Functionalization of carbon nanofiber and its effect on tensile properties of PA11 matrix composite reinforced with carbon nanofiber AIP Conference Proceedings 1779, 040001 (2016) Abstract. For the purpose of developing the new polymeric tribomaterials using biopolymer, the fabrication of microstructured surfaces of plants-derived polyamide (PA) using femtosecond laser and their frictional properties were investigated. In this study, the effect of processing parameter such as laser power, laser speed and pitch distance on the fabrication of micro-structured surfaces of polyamide 66 (PA66) and plants-derived polyamide 1010 (PA1010) was investigated experimentally, and their frictional properties and wettability were evaluated. Polyamides (PA1010 and PA66) were extruded by a twin screw extruder and injection-molded to 30mm x 30mm x 3mm sheet. The microstructured surfaces on the polyamides were fabricated by femtosecond laser. The micro-structured surfaces on the polyamides by laser fabrication were observed by laser microscope and scanning electron microscope (SEM). Frictional properties were measured by a ball on plate reciprocating type sliding wear tester under lubrication conditions. It was found that the surface microchannels are able to be fabricated by the femtosecond laser and have a good effect for the improvement of the frictional properties and wettability of PA66 and plants-derived PA1010. Laser power influences strongly on the microchannels size, wettability and frictional properties. This may be attributed that the micro-structured surface plays an important role in the key components for the polymeric tribomaterials.

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Section: Resultssupporting

confidence: 78%

Fabrication of micro-structured surface of plants-derived polyamide using femtosecond laser and their frictional properties

Nakamura¹,

Naruse²,

Nishitani³

et al. 2016

AIP Conference Proceedings

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“…While laser pulses with a duration in the nanosecond regime offer good micromachining speeds for silicon and metals and, under the right conditions, can be used to ablate wider bandgap dielectrics [16][17][18][19][20], they produce a large heat-affected zone (HAZ) and droplets in and around the ablated area.…”

Section: Introductionmentioning

confidence: 99%

“…Furthermore, the thermal penetration depth of femtosecond pulses is very small, leading to a minimized volume in which energy is deposited by each pulse [19][20][21][22][23][24][25]. Unfortunately, femtosecond laser systems are 2 more expensive than nanosecond systems of matching ablation performance (in terms of material removed in unit time).…”

Section: Introductionmentioning

confidence: 99%

Picosecond laser ablation for silicon micro fuel cell fabrication

Scotti¹,

Trusheim²,

Kanninen³

et al. 2013

J. Micromech. Microeng.

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Abstract:We have investigated laser ablation as a microfabrication approach to produce micro fuel cells (MFCs) in silicon. Picosecond pulses (15 ps) at a wavelength of 355 nm are used to make all of the MFC structures. To assess the benefits and drawbacks of laser ablation, reference cells have been produced by deep reactive ion etching (DRIE) using matching geometries. Ablated and etched cells have been evaluated and compared side by side. Our conclusion is that picosecond laser ablation is very well suited for MFC fabrication. The ablated cells match or excel DRIE-microfabricated cells in terms of current and power densities. Ablated MFCs achieved 47.6 mW cm -2 of power density and 121 mA cm -2 current density.

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“…This configuration seemed to be a good compromise between minimal kerf widths and practicable focal depth. The polarization of the laser beam was oriented perpendicular to the scan direction for cutting the sides being bended in the bending test experiments, because numerous studies have already demonstrated that cuts become straighter and the surface quality of the sidewalls is higher under this condition [16,20,21]. It should be noted that the orientation of the polarization with respect to the scan direction changed as the chips were cut in the other two directions.…”

Section: Methodsmentioning

confidence: 99%

“…This could be related to the following phenomena. Self-organizing periodic holes arise during scribing of Si [16,17], which cause periodic kerfs at the lower sidewalls and backside after cutting the chips. The kerfs act as stress concentrators, which reduces the breaking strength of the chip backside [6,8,18].…”

Section: Introductionmentioning

confidence: 99%

Ultrafast-laser dicing of thin silicon wafers: strategies to improve front- and backside breaking strength

Domke

Egle²,

Stroj

et al. 2017

Appl. Phys. A

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increase the distance between separated dies and step cuts to minimize the effect of decreasing fluence during scribing were performed. Bending tests revealed that breaking strengths of about 1100 MPa could be achieved also on the backside using the step cut. A reason for the superior performance could be found by calculating the fluence absorbed by the sidewalls. The calculations suggested that an optimal fluence level to minimize thermal side effects and periodic surface structures was achieved due to the step cut. Remarkably, the best breaking strengths values achieved in this study were even higher than the values obtained on state of the art ns-laser and mechanical dicing machines. This is the first study to the knowledge of the authors, which demonstrates that ultrafast-laser dicing improves the mechanical stability of thin silicon chips.

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Femtosecond laser micromachining of grooves in silicon with 800 nm pulses

Cited by 107 publications

References 30 publications

Fabrication of micro-structured surface of plants-derived polyamide using femtosecond laser and their frictional properties

Fabrication of micro-structured surface of plants-derived polyamide using femtosecond laser and their frictional properties

Picosecond laser ablation for silicon micro fuel cell fabrication

Ultrafast-laser dicing of thin silicon wafers: strategies to improve front- and backside breaking strength

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