Femtosecond-Laser-Ablation Dynamics in Silicon Revealed by Transient Reflectivity Change

Feng, Ting; Gong, Chen; Han, Hainian; Qiao, Jie

doi:10.3390/mi13010014

Cited by 12 publications

(5 citation statements)

References 37 publications

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“…First, undoped silicon wafers were cleaned with acetone, ethanol, and deionized water for 30 min to obtain a clean surface. The femtosecond laser (343 nm, 200 kHz, 280 fs (Light Conversion Pharos, Vilnius, Lithuania)) is tightly focused through a high numerical aperture objective lens (NA = 0.95, 40×) and matched with a three-dimensional piezoelectric platform (the strokes of the xand y-axes are 1.5 mm, that of the z-axis is 100 µm, and accuracy is 1 nm) to realize the preparation of micro/nanostructures on the silicon surface [24][25][26][27][28][29]. In addition, the femtosecond laser can also be used to process other materials via multi-photon absorption, for example, lift off GaN [30,31].…”

Section: Methodsmentioning

confidence: 99%

Integration of Multifocal Microlens Array on Silicon Microcantilever via Femtosecond-Laser-Assisted Etching Technology

Wang

Zheng

et al. 2022

Micromachines

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Micro-opto-electromechanical systems (MOEMSs) are a new class of integrated and miniaturized optical systems that have significant applications in modern optics. However, the integration of micro-optical elements with complex morphologies on existing micro-electromechanical systems is difficult. Herein, we propose a femtosecond-laser-assisted dry etching technology to realize the fabrication of silicon microlenses. The size of the microlens can be controlled by the femtosecond laser pulse energy and the number of pulses. To verify the applicability of this method, multifocal microlens arrays (focal lengths of 7–9 μm) were integrated into a silicon microcantilever using this method. The proposed technology would broaden the application scope of MOEMSs in three-dimensional imaging systems.

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Section: Methodsmentioning

confidence: 99%

Integration of Multifocal Microlens Array on Silicon Microcantilever via Femtosecond-Laser-Assisted Etching Technology

Wang

Zheng

et al. 2022

Micromachines

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“…It is essential to note that the dielectric function ε may comprise more terms than the simplified Eq. ( 4) typically used for describing excited semiconductors [17,18]. Most of the time, the two-photon absorption coefficient is neglected because the photon energy is greater than the bandgap of material.…”

Section: Semiconductors and Dielectricsmentioning

confidence: 99%

Fundamentals of Ultrashort Pulse Laser Interactions: Mechanisms, Material Responses, and the Genesis of LIPSS

Vaghasiya,

Miclea

2024

Pulsed Laser Processing of Materials

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In recent years, ultrashort pulse laser-material processing has gained significant attention due to its broad applications across nearly all manufacturing sectors. This chapter delves into the foundational aspects of the ultrashort pulse laser-material interaction and elucidates the intricacies of the underlying ablation mechanisms. Due to peculiarities between the metal energy absorption in contrast to the semiconductor or dielectric, the first section provides an in-depth exploration of laser-material dynamics, emphasizing the unique responses of various substrates under ultrashort pulse irradiation. A theoretical analysis of ultrashort laser-matter interaction can be represented by the two-temperature model, which describes the temperature of the electron or carrier and lattice in non-equilibrium conditions when ultrashort laser pulses are applied. As the narrative progresses, the spotlight shifts to one of the most interesting phenomena associated with these interactions: the formation of Laser-Induced Periodic Surface Structures (LIPSS). The second section unravels the genesis and evolution of LIPSS, demystifying LIPSS formation mechanisms and the pivotal role played by the ultrashort pulse duration.

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“…Unfortunately, these processes are complicated, and sometimes it is hard to control how pure the product is [4]. The process of using laser ablation to create nanoparticles (NPs) can be divided into two types: dry laser ablation and wet laser ablation [5].…”

Section: Introductionmentioning

confidence: 99%

Synthesis of Nano Silicon Using Lasers

Muaath J. Mahmoud,

Bassam G. Rasheed

2024

IJNeaM

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Two lasers of the same wavelength (1.06 μm) and various specifications were employed to synthesize silicon nanoparticles. The experimental data reveal the formation of stable silicon nanoparticles with different features such as UV-vis absorption, photoluminescence spectrum, Raman spectrum, Zeta potential, and SEM morphology. Theoretical simulations using COMSOL software were adopted to estimate the surface temperature distribution at the silicon surface and underneath. It is found that maximum temperatures of about (5700 K) and (4600 K) were generated when a Q-switched laser pulse of (10 ns) and fiber laser pulse of (127 ns) were used, respectively. While the recoil pressure at the silicon surface was (6.5*105 N/m2) and (1*103 N/m2) when Nd:YAG and fiber laser were used respectively. It found that increasing the laser energy for Nd:YAG laser and fiber laser power leads to a blue shift of the absorption spectra while the absorption intensity increases with the number of laser pulses and irradiation time. Raman spectroscopy for the prepared silicon nanoparticles was carried out. The Raman peaks for silicon nanoparticles reveal the formation of amorphous silicon. These peaks were observed at (482) and (475 cm-1) when Nd:YAG and fiber lasers were used to produce those nanoparticles. While the photoluminescence of the prepared silicon nanoparticles exhibits peaks at (457 nm) and (495 nm) for Nd:YAG and fiber lasers. The zeta potential reveals that silicon nanoparticle stability is greater for nanoparticles produced by fiber lasers (27 mv) than those produced by Nd:YAG lasers (17 mv) for three months. The corresponding silicon nanoparticle sizes refer to (3.8 nm) and (6 nm). Potential applications of silicon nanoparticles in optoelectronics and biological imaging can be conducted due to the controllable laser micro/nano machining process.

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Femtosecond-Laser-Ablation Dynamics in Silicon Revealed by Transient Reflectivity Change

Cited by 12 publications

References 37 publications

Integration of Multifocal Microlens Array on Silicon Microcantilever via Femtosecond-Laser-Assisted Etching Technology

Integration of Multifocal Microlens Array on Silicon Microcantilever via Femtosecond-Laser-Assisted Etching Technology

Fundamentals of Ultrashort Pulse Laser Interactions: Mechanisms, Material Responses, and the Genesis of LIPSS

Synthesis of Nano Silicon Using Lasers

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