Abstract:This paper presents a feasibility study of wireless power and data transmission through an inductive link to a 1-mm implant, to be used as a free-floating neural probe, distributed across a brain area of interest. The proposed structure utilizes a four-coil inductive link for back telemetry, shared with a three-coil link for wireless power transmission. We propose a design procedure for geometrical optimization of the inductive link in terms of power transmission efficiency (PTE) considering specific absorptio… Show more
“…η Rx is the ratio of the power delivered to R L to the power dissipated in the secondary coil due to its parasitic resistance, R s2 . 1) Optimizing Rx: After applying the common design constraints such as D o2 = 4 mm, each coil was designed by following the coil optimization procedure in [13], [15], [40] in a way to maximize Rx P RS , which is a multiplication between the loaded Q factor, Q 2L = wL s2 /(R s2 + R L ), and the Rx internal efficiency, η RX = R L /(R 2 + R L )). For the around-CMOS design, p 2 is fixed because this design parameter is not controllable during the semi-manual coil fabrication.…”
Section: B Optimizationmentioning
confidence: 99%
“…The geometrical and electrical parameters of the 2-coil inductive link for three different Rx coils are summarized in Table I. The operating frequency of each inductive link is individually optimized by adopting the methodology in [13], [15], [40]. According to optimized simulation results in Table I, around-CMOS, above-CMOS and in-CMOS coils in biological tissue environments operate at 300 MHz, 330 MH and 60 MHz, respectively.…”
Next generation implantable neural interfaces are targeting devices with mm-scale form factors that are freely floating and completely wireless. Scalability to more recording (or stimulation) channels will be achieved through distributing multiple devices, instead of the current approach that uses a single centralized implant wired to individual electrodes or arrays. In this way, challenges associated with tethers, micromotion, and reliability of wiring is mitigated. This concept is now being applied to both central and peripheral nervous system interfaces. One key requirement, however, is to maximize specific absorption rate (SAR) constrained achievable wireless power transfer efficiency (PTE) of these inductive links with mm-sized receivers. Chip-scale coil structures for microsystem integration that can provide efficient near-field coupling are investigated. We develop near-optimal geometries for three specific coil structures: in-CMOS, above-CMOS (planar coil post-fabricated on a substrate), and around-CMOS (helical wirewound coil around substrate). We develop analytical and simulation models that have been validated in air and biological tissues by fabrications and experimental measurements. Specifically, we prototype structures that are constrained to a 4 mm 4 mm silicon substrate, i.e., the planar in-/above-CMOS coils have outer diameters 4 mm, whereas the around-CMOS coil has an inner diameter of 4 mm. The in-CMOS and above-CMOS coils have metal film thicknesses of 3- m aluminium and 25- m gold, respectively, whereas the around-CMOS coil is fabricated by winding a 25-m gold bonding wire around the substrate. The measured quality factors (Q) of the mm-scale Rx coils are 10.5 @450.3 MHz (in-CMOS), 24.61 @85 MHz (above-CMOS), and 26.23 @283 MHz (around-CMOS). Also, PTE of 2-coil links based on three types of chip-scale coils is measured in air and tissue environment to demonstrate tissue loss for bio-implants. The SAR-constrained maximum PTE measured (together with resonant frequencies, in tissue) are 1.64% @355.8 MHz (in-CMOS), 2.09% @82.9 MHz (above-CMOS), and 3.05% @318.8 MHz (around-CMOS).
“…η Rx is the ratio of the power delivered to R L to the power dissipated in the secondary coil due to its parasitic resistance, R s2 . 1) Optimizing Rx: After applying the common design constraints such as D o2 = 4 mm, each coil was designed by following the coil optimization procedure in [13], [15], [40] in a way to maximize Rx P RS , which is a multiplication between the loaded Q factor, Q 2L = wL s2 /(R s2 + R L ), and the Rx internal efficiency, η RX = R L /(R 2 + R L )). For the around-CMOS design, p 2 is fixed because this design parameter is not controllable during the semi-manual coil fabrication.…”
Section: B Optimizationmentioning
confidence: 99%
“…The geometrical and electrical parameters of the 2-coil inductive link for three different Rx coils are summarized in Table I. The operating frequency of each inductive link is individually optimized by adopting the methodology in [13], [15], [40]. According to optimized simulation results in Table I, around-CMOS, above-CMOS and in-CMOS coils in biological tissue environments operate at 300 MHz, 330 MH and 60 MHz, respectively.…”
Next generation implantable neural interfaces are targeting devices with mm-scale form factors that are freely floating and completely wireless. Scalability to more recording (or stimulation) channels will be achieved through distributing multiple devices, instead of the current approach that uses a single centralized implant wired to individual electrodes or arrays. In this way, challenges associated with tethers, micromotion, and reliability of wiring is mitigated. This concept is now being applied to both central and peripheral nervous system interfaces. One key requirement, however, is to maximize specific absorption rate (SAR) constrained achievable wireless power transfer efficiency (PTE) of these inductive links with mm-sized receivers. Chip-scale coil structures for microsystem integration that can provide efficient near-field coupling are investigated. We develop near-optimal geometries for three specific coil structures: in-CMOS, above-CMOS (planar coil post-fabricated on a substrate), and around-CMOS (helical wirewound coil around substrate). We develop analytical and simulation models that have been validated in air and biological tissues by fabrications and experimental measurements. Specifically, we prototype structures that are constrained to a 4 mm 4 mm silicon substrate, i.e., the planar in-/above-CMOS coils have outer diameters 4 mm, whereas the around-CMOS coil has an inner diameter of 4 mm. The in-CMOS and above-CMOS coils have metal film thicknesses of 3- m aluminium and 25- m gold, respectively, whereas the around-CMOS coil is fabricated by winding a 25-m gold bonding wire around the substrate. The measured quality factors (Q) of the mm-scale Rx coils are 10.5 @450.3 MHz (in-CMOS), 24.61 @85 MHz (above-CMOS), and 26.23 @283 MHz (around-CMOS). Also, PTE of 2-coil links based on three types of chip-scale coils is measured in air and tissue environment to demonstrate tissue loss for bio-implants. The SAR-constrained maximum PTE measured (together with resonant frequencies, in tissue) are 1.64% @355.8 MHz (in-CMOS), 2.09% @82.9 MHz (above-CMOS), and 3.05% @318.8 MHz (around-CMOS).
“…Regardless of the powering method used, as the receiver shrinks, it becomes increasingly difficult to deliver sufficient power to operate the IMD, which can range from a few to several hundred microwatts depending on the application. This puts a heavy burden on the miniaturization of coils and piezo devices, which explains why many state-of-the-art single channel devices remain bulky [5][6][7][8][9] . Ultimately, these devices will need to be surgically implanted into the brain but the technology remains too large for human applications.…”
Ultra-compact wireless implantable medical devices are in great demand for healthcare applications, in particular for neural recording and stimulation. Current implantable technologies based on miniaturized micro-coils suffer from low wireless power transfer efficiency (PTE) and are not always compliant with the specific absorption rate imposed by the Federal Communications Commission. Moreover, current implantable devices are reliant on differential recording of voltage or current across space and require direct contact between electrode and tissue. Here, we show an ultra-compact dual-band smart nanoelectromechanical systems magnetoelectric (ME) antenna with a size of 250 × 174 µm2 that can efficiently perform wireless energy harvesting and sense ultra-small magnetic fields. The proposed ME antenna has a wireless PTE 1–2 orders of magnitude higher than any other reported miniaturized micro-coil, allowing the wireless IMDs to be compliant with the SAR limit. Furthermore, the antenna’s magnetic field detectivity of 300–500 pT allows the IMDs to record neural magnetic fields.
“…This assumes parasitics due to the transcranial interconnects are negligible. The PTE can therefore be written as η = η 1,eq • η eq,4 , where η 1,eq and η eq,4 can be found from [14]. Thus, for the proposed WPT system, the PTE can be expressed as…”
This paper presents a novel wireless power transfer (WPT) scheme that consists of a two-tier hierarchy of nearfield inductively coupled links to provide efficient power transfer efficiency (PTE) and uniform energy distribution for mm-scale free-positioned neural implants. The top tier facilitates a transcutaneous link from a scalp-worn (cm-scale) primary coil to a subcutaneous array of smaller, parallel-connected secondary coils. These are then wired through the skull to a corresponding set of parallel connected primary coils in the lower tier, placed epidurally. These then inductively couple to freely positioned (mm-scale) secondary coils within each subdural implant. This architecture has three key advantages: (1) the opportunity to achieve efficient energy transfer by utilising two short-distance inductive links; (2) good uniformity of the transdural power distribution through the multiple (redundant) coils; and (3) a reduced risk of infection by maintaining the dura protecting the blood-brain barrier. The functionality of this approach has been verified and optimized through HFSS simulations, to demonstrate the robustness against positional and angular misalignment. The average 11.9% PTE and 26.6% power distribution deviation (PDD) for horizontally positioned Rx coil and average 2.6% PTE and 62.8% power distribution deviation for the vertical Rx coil have been achieved.
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