This paper presents an inductive link for wireless power transmission (WPT) to mm-sized free-floating implants (FFIs) distributed in a large three-dimensional space in the neural tissue that is insensitive to the exact location of the receiver (Rx). The proposed structure utilizes a high-Q resonator on the target wirelessly powered plane that encompasses randomly positioned multiple FFIs, all powered by a large external transmitter (Tx). Based on resonant WPT fundamentals, we have devised a detailed method for optimization of the FFIs and explored design strategies and safety concerns, such as coil segmentation and specific absorption rate limits using realistic finite element simulation models in HFSS including head tissue layers, respectively. We have built several FFI prototypes to conduct accurate measurements and to characterize the performance of the proposed WPT method. Measurement results on 1-mm receivers operating at 60 MHz show power transfer efficiency and power delivered to the load at 2.4% and 1.3 mW, respectively, within 14-18 mm of Tx-Rx separation and 7 cm of brain surface.

Next generation implantable neural interfaces are targeting devices with mm-scale form factors that are freely floating and completely wireless. Scalability to more recording (or stimulation) channels will be achieved through distributing multiple devices, instead of the current approach that uses a single centralized implant wired to individual electrodes or arrays. In this way, challenges associated with tethers, micromotion, and reliability of wiring is mitigated. This concept is now being applied to both central and peripheral nervous system interfaces. One key requirement, however, is to maximize specific absorption rate (SAR) constrained achievable wireless power transfer efficiency (PTE) of these inductive links with mm-sized receivers. Chip-scale coil structures for microsystem integration that can provide efficient near-field coupling are investigated. We develop near-optimal geometries for three specific coil structures: in-CMOS, above-CMOS (planar coil post-fabricated on a substrate), and around-CMOS (helical wirewound coil around substrate). We develop analytical and simulation models that have been validated in air and biological tissues by fabrications and experimental measurements. Specifically, we prototype structures that are constrained to a 4 mm 4 mm silicon substrate, i.e., the planar in-/above-CMOS coils have outer diameters 4 mm, whereas the around-CMOS coil has an inner diameter of 4 mm. The in-CMOS and above-CMOS coils have metal film thicknesses of 3- m aluminium and 25- m gold, respectively, whereas the around-CMOS coil is fabricated by winding a 25-m gold bonding wire around the substrate. The measured quality factors (Q) of the mm-scale Rx coils are 10.5 @450.3 MHz (in-CMOS), 24.61 @85 MHz (above-CMOS), and 26.23 @283 MHz (around-CMOS). Also, PTE of 2-coil links based on three types of chip-scale coils is measured in air and tissue environment to demonstrate tissue loss for bio-implants. The SAR-constrained maximum PTE measured (together with resonant frequencies, in tissue) are 1.64% @355.8 MHz (in-CMOS), 2.09% @82.9 MHz (above-CMOS), and 3.05% @318.8 MHz (around-CMOS).

A fully-integrated power management ASIC for efficient inductive power transmission has been presented capable of automatic load transformation using a method, called Q-modulation. Q-modulation is an adaptive scheme that offers load matching against a wide range of loading (RL) and coupling distance (d23) variations in inductive links to maintain high power transfer efficiency (PTE). It is suitable for inductive powering implantable microelectronic devices (IMDs), recharging mobile electronics, and electric vehicles. In Q-modulation, the zero-crossings of the induced current in the receiver (Rx) LC-tank are detected and a low-loss switch chops the Rx LC-tank for part of the power carrier cycle to form a high-Q LC-tank and store the maximum energy, which is then transferred to RL by opening the switch. By adjusting the duty cycle (D), the loaded-Q of the Rx LC-tank can be dynamically modulated to compensate for variations in RL. A Q-modulation power management (QMPM) prototype chip was fabricated in a 0.35-μm standard CMOS process, occupying 4.8 mm2. In a 1.45 W wireless power transfer setup, using a class-E power amplifier (PA) operating at 2 MHz, the QMPM successfully increased the inductive link PTE and the overall power efficiency by 98.5% and 120.7% at d23 = 8 cm, respectively, by compensating for 150 Ω variation in RL at D = 45%.

Lightweight, flexible, stretchable, and wireless sensing platforms have gained significant attention for personal healthcare and environmental monitoring applications. This paper introduces an all-soft (flexible and stretchable), battery-free, and wireless chemical microsystem using gallium-based liquid metal (eutectic gallium-indium alloy, EGaIn) and poly(dimethylsiloxane) (PDMS), fabricated using an advanced liquid metal thin-line patterning technique based on soft lithography. Considering its flexible, stretchable, and lightweight characteristics, the proposed sensing platform is well suited for wearable sensing applications either on the skin or on clothing. Using the microfluidic sensing platform, detection of liquid-phase and gas-phase volatile organic compounds (VOC) is demonstrated using the same design, which gives an opportunity to have the sensor operate under different working conditions and environments. In the case of liquid-phase chemical sensing, the wireless sensing performance and microfluidic capacitance tunability for different dielectric liquids are evaluated using analytical, numerical, and experimental approaches. In the case of gas-phase chemical sensing, PDMS is used both as a substrate and a sensing material. The gas sensing performance is evaluated and compared to a silicon-based, solid-state gas sensor with a PDMS sensing film.