2007 IEEE International Electron Devices Meeting 2007
DOI: 10.1109/iedm.2007.4418857
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FBC's Potential of 6F2 Single Cell Operation in Multi-Gbit Memories Confirmed by a Newly Developed Method for Measuring Signal Sense Margin

Abstract: an optimum cell design without degrading the retention time.A 6F2 single cell (one-cell-per-bit) operation of the floating Operation of FBC and Memory Yield body RAM (FBRAM) is successfully demonstrated for the first time with more than 60% yield of 16Mbit area in a wafer. Fig. 1 shows the operational principle of the FBC. DataThe signal sense margin (SSM) at actual read conditions is states are stored in the form of the floating body potential. To found to well back up the functional results. The parasitic wr… Show more

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Cited by 14 publications
(7 citation statements)
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“…We have developed a novel method of measuring the cell current as a function of RDT. The detail of the method has already been reported [16]. Fig.…”
Section: Memory Cell Characteristicsmentioning
confidence: 99%
See 3 more Smart Citations
“…We have developed a novel method of measuring the cell current as a function of RDT. The detail of the method has already been reported [16]. Fig.…”
Section: Memory Cell Characteristicsmentioning
confidence: 99%
“…Here we have introduced an index of the signal sense margin (SSM), which predicts the memory chip yield. That is defined as In order to clarify the functionality of the single-cell operation, fail bit count of the 16 Mb area of one chip as a function of WL voltage at read (V WLHR ) as a parameter of read duration time (RDT) has been investigated, which is shown in Fig. 6.…”
Section: Memory Cell Characteristicsmentioning
confidence: 99%
See 2 more Smart Citations
“…Originally, partially depleted silicon-on-insulator (SOI) devices were used to demonstrate the working principle [1]. Later on, more scalable devices were also shown [2]- [4], and in [5] and [6], a 1T-DRAM cell realized on a bulk substrate has also been demonstrated. In particular, bulk FinFET devices are of high interest because they are more scalable than planar bulk devices, have an extra degree of freedom (fin height) for increasing the charge storage area, and can be cointegrated with planar bulk devices and, at the same time, avoid the problem of heat dissipation, which is present in SOI FinFET devices.…”
Section: Introductionmentioning
confidence: 97%