FBAR Rx filters for handset front-end modules with wafer-level packaging

Wang, Kun; Frank, Martin J.; Bradley, P.; Ruby, R.; Mueller, W. F.; Barfknecht, A.T.; Gat, Moshe

doi:10.1109/ultsym.2003.1293379

Cited by 10 publications

(2 citation statements)

References 5 publications

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“…There exist various packaging methods for protecting FBAR filters. Figure 1(a) shows a microcapped FBAR with through-wafer interconnection [11,12]. Figure 1(b) shows another type of microcap, which can be fabricated directly on the device chip using a surface micromachining technique [13].…”

Section: Introductionmentioning

confidence: 99%

“…Figure 1(b) shows another type of microcap, which can be fabricated directly on the device chip using a surface micromachining technique [13]. In short, the microcap method [11][12][13] is regarded as the easiest way to protect the thin film resonance region of a FBAR. After that, the standard IC fabrication processes such as dicing and passivation can be directly employed to handle the suspended microsystem devices.…”

Section: Introductionmentioning

confidence: 99%

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Encapsulation of film bulk acoustic resonator filters using a wafer-level microcap array

Lin

Lu²,

Fang

2005

J. Micromech. Microeng.

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A simple method of protecting film bulk acoustic resonator (FBAR) filters by wafer-level packaging is proposed. This method employs a reliable silicon microcap structure to encapsulate FBAR filters. Since only conventional processes and facilities were required to accomplish this work, it is a cost-effective way to package FBAR filters. The fabrication process consists of three steps: cavity etching, wafer bonding and wafer singulation. In this study, the design and fabrication processes are described in detail. Moreover, a filter designed for personal communication systems (PCS) transmitter band is measured to demonstrate the performance variation after the microcap process. The fabrication results and measurement results have ensured the effectiveness of this process.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Encapsulation of film bulk acoustic resonator filters using a wafer-level microcap array

Lin

Lu²,

Fang

2005

J. Micromech. Microeng.

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Tuning the Resonant Frequency of Resonators Using Molecular Surface Self-assembly Approach

Liu

Wang

et al. 2014

ACS Appl. Mater. Interfaces

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In this work, a new method to tune the resonant frequency of microfabricated resonator using molecular layer-by-layer (LbL) self-assembly approach is demonstrated. By simply controlling the polymer concentration and the number of layers deposited, precisely tuning the frequency of microfabricated resonators is realized. Due to its selective deposition through specific molecular recognitions, such technique avoids the high-cost and complex steps of conventional semiconductor fabrications and is able to tune individual diced device. Briefly, film bulk acoustic resonator (FBAR) is used to demonstrate the tuning process and two types of LbL deposition methods are compared. The film thickness and morphology have been characterized by UV-vis reflection spectra, ellipsometer and AFM. As a result, the maximum resonant frequency shift of FBAR reaches more than 20 MHz, meaning 1.4% tunability at least. The minimum frequency shift is nearly 10 kHZ per bilayer, indicating 7 ppm tuning resolution. Pressure cooker test (PCT) is performed to evaluate the reliability of LbL coated FBAR. Furthermore, applications for wireless broadband communication and chemical sensors of LbL coated FBAR have been demonstrated.

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3D stack packaging solution for BAW devices: 3D packaging demonstrator and RF performance

Sun

Posada

Majeed

et al. 2011

2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC)

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FBAR Rx filters for handset front-end modules with wafer-level packaging

Cited by 10 publications

References 5 publications

Encapsulation of film bulk acoustic resonator filters using a wafer-level microcap array

Encapsulation of film bulk acoustic resonator filters using a wafer-level microcap array

Tuning the Resonant Frequency of Resonators Using Molecular Surface Self-assembly Approach

3D stack packaging solution for BAW devices: 3D packaging demonstrator and RF performance

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