Fatigue Properties of Lead-free Doped Solder Joints

Su, Sinan; Akkara, Francy John; Abueed, Mohammed; Jian, Minghong; Hamasha, Sa’d; Suhling, Jeff; Lall, Pradeep

doi:10.1109/itherm.2018.8419566

Cited by 21 publications

(2 citation statements)

References 26 publications

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“…There are limited studies dealing with the accelerated shear fatigue stress of solder materials in electronic assemblies. The effects of diverse surface finishes on the performance of Sn-3.0Ag-0.5Cu were discussed (Su et al , 2018) and it was demonstrated that the fatigue properties and shear strength both increased by using an immersion silver (ImAg) surface finish in comparison with other commercially available materials. Andersson et al (2005) analyzed the discrepancies between the distribution of precipitates with bulk solder samples and real solder interconnections.…”

Section: Introductionmentioning

confidence: 99%

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Siswanto

Borodin

Mahmoud

et al. 2021

SSMT

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Purpose The purpose of this study is to investigate the effect of aging temperature on the barrel-type solder joint lifetime of electronic devices and to include these effects in the modified prediction model. Design/methodology/approach Several accelerated shear stress tests under different stress amplitudes and aging temperatures were performed. Findings It was found that by aging temperature increasing, the lifetime decreases. Morrow energy model was also found as the best prediction model when the aging temperature is taken into consideration. Originality value It is confirmed.

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Section: Introductionmentioning

confidence: 99%

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Siswanto

Borodin

Mahmoud

et al. 2021

SSMT

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“…Microelectronic chips are becoming more popular, because their design in smaller dimensions meets the requirements of semiconductor packaging in terms of high-density and cost-effective performance. The solder layer plays an important role in the mechanical and electric connections of the chip; therefore, its performance, especially the thermomechanical properties of the solder, has become an important factor affecting the reliability of microelectronic chips [1][2][3]. During the service process, the chips are subjected to temperature cycling caused by circuit continuity and ambient temperature changes [4].…”

Section: Introductionmentioning

confidence: 99%

GA-BP in Thermal Fatigue Failure Prediction of Microelectronic Chips

Han

Huang

2019

Electronics

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A thermal fatigue life prediction model of microelectronic chips based on thermal fatigue tests and solder/substrate interfacial singularity analysis from finite element method (FEM) analysis is established in this paper. To save the calculation of interfacial singular parameters of new chips for life prediction, and improve the accuracy of prediction results in actual applications, a hybrid genetic algorithm–artificial neural network (GA–ANN) strategy is utilized. The proposed algorithm combines the local searching ability of the gradient-based back propagation (BP) strategy with the global searching ability of a genetic algorithm. A series of combinations of the dimensions and thermal mechanical properties of the solder and the corresponding singularity parameters at the failure interface are used to train the proposed GA-BP network. The results of the network, together with the established life prediction model, are used to predict the thermal fatigue lives of new chips. The comparison between the network results and thermal fatigue lives recorded in experiments shows that the GA-BP strategy is a successful prediction technique.

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Mechanical Properties and Microstructural Fatigue Damage Evolution in Cyclically Loaded Lead-Free Solder Joints

Hoque

Chowdhury

et al. 2019

2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

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Fatigue Properties of Lead-free Doped Solder Joints

Cited by 21 publications

References 26 publications

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

GA-BP in Thermal Fatigue Failure Prediction of Microelectronic Chips

Mechanical Properties and Microstructural Fatigue Damage Evolution in Cyclically Loaded Lead-Free Solder Joints

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