2019 IEEE 69th Electronic Components and Technology Conference (ECTC) 2019
DOI: 10.1109/ectc.2019.00125
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Mechanical Properties and Microstructural Fatigue Damage Evolution in Cyclically Loaded Lead-Free Solder Joints

Sinan Su
1
,
Mohd Aminul Hoque
2
,
Mahmudur R. Chowdhury
3
et al.
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Cited by 10 publications
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References 26 publications
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Solder Joints in PCB Assembly and Semiconductor Packaging

Lau
1
,
Lee
2
2020
Assembly and Reliability of Lead-Free Solder Joints
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Solder Joints in PCB Assembly and Semiconductor Packaging

Lau
1
,
Lee
2
2020
Assembly and Reliability of Lead-Free Solder Joints
0
0
0
0
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Effect of Bismuth Content on the Mechanical Cyclic Properties of SAC+Bi Lead Free Solders

Haq
1
,
Hoque
2
,
Suhling
3
et al. 2021
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Mechanical Behavior and Microstructure Evolution in Lead Free Solders Subjected to Mechanical Cycling at Elevated Temperatures

Hoque
1
,
Haq
2
,
Suhling
3
et al. 2021
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
6
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