Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling

Engelmaier, W.

doi:10.1109/tchmt.1983.1136183

Cited by 308 publications

(72 citation statements)

References 5 publications

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“…(6)) [7] developed by Engelmaier presents the influence of both temperature and frequency on creep-fatigue, where a logarithmic relationship between temperature and frequency is included.…”

Section: Brief Review Of Existing Creep-fatigue Modelsmentioning

confidence: 99%

A Unified Creep-Fatigue Equation with Application to Engineering Design

Liú¹,

Pons²

2018

Creep

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Background: Creep-fatigue damage occurs under cyclic loading at elevated temperature. The existing creep-fatigue models have limited ability to cover the full combination of creep and fatigue behaviours, except with extensive prior empirical testing. Consequently, they cannot effectively and efficiently be used for early engineering design.Approach: We present a strain-based unified creep-fatigue formulation that overcomes these limitations. We validate this equation against empirical data for multiple materials, and shows it is able to cover full ranges from pure fatigue to pure creep. A simplified formulation is developed where the coefficients are extracted through simple creep-rupture tests. We show how the equation may be used in a design situation, by application to a representative gas turbine blisk. Included here is a demonstration of how the equation may be integrated into finite element analysis, which is an important practical consideration in the design work flow.Outcomes: The results demonstrate that the unified equation evidences fidelity to empirical data for creep-fatigue behaviours for multiple metallic materials. The usefulness of this equation is the ability to identify candidate materials for creep-fatigue loading situations. The ability to achieve this at relatively early design stages is advantageous because of the economy and convenience provided.

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“…(6)) [7] developed by Engelmaier presents the influence of both temperature and frequency on creep-fatigue, where a logarithmic relationship between temperature and frequency is included.…”

Section: Brief Review Of Existing Creep-fatigue Modelsmentioning

confidence: 99%

A Unified Creep-Fatigue Equation with Application to Engineering Design

Liú¹,

Pons²

2018

Creep

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show abstract

“…The Engelmaier model has been used in several studies to successfully estimate the fatigue life of eutectic Pb-Sn solder [12,13]. Engelmaier's model is a Coffin-Manson based relation that accounts for the mean temperature of the cycle, and the number of cycles per day…”

Section: Solder Fatigue Life Modelmentioning

confidence: 99%

“…Several researchers have reported successful results using the Kanchanomai model for Sn96.5-Ag3.5 which is similar in composition to Sn95-Sb5 [13,14]. Kanchanomai defined the number of cycles to failure by the following relationship:…”

Section: Solder Fatigue Life Modelmentioning

confidence: 99%

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Harsh-Environment Packaging for Downhole Gas and Oil Exploration

Bansal¹,

Cho²,

Durocher³

et al. 2007

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“…Manson model for leadless components to determine the fatigue life relationship for temperature loading (50), (51) was selected to calculate the RUL. The damage to the components and time to failure due to the thermal cycling on the components were calculated.…”

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confidence: 99%